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the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 15:51:08 +08:00
#
# Generic thermal sysfs drivers configuration
#
menuconfig THERMAL
thermal: add the support for building the generic thermal as a module Build the generic thermal driver as module "thermal_sys". Make ACPI thermal, video, processor and fan SELECT the generic thermal driver, as these drivers rely on it to build the sysfs I/F. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-21 16:07:13 +08:00
tristate "Generic Thermal sysfs driver"
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 15:51:08 +08:00
help
Generic Thermal Sysfs driver offers a generic mechanism for
thermal management. Usually it's made up of one or more thermal
zone and cooling device.
ACPI: thermal: syntax, spelling, kernel-doc Reviewed-by: Randy Dunlap <randy.dunlap@oracle.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-08 05:55:08 +08:00
Each thermal zone contains its own temperature, trip points,
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 15:51:08 +08:00
cooling devices.
All platforms with ACPI thermal support can use this driver.
thermal: add the support for building the generic thermal as a module Build the generic thermal driver as module "thermal_sys". Make ACPI thermal, video, processor and fan SELECT the generic thermal driver, as these drivers rely on it to build the sysfs I/F. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-21 16:07:13 +08:00
If you want this support, you should say Y or M here.
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-25 01:38:56 +08:00
config THERMAL_HWMON
thermal: hide CONFIG_THERMAL_HWMON It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-07-29 04:48:40 +08:00
bool
thermal: add missing Kconfig dependency Otherwise THERMAL_HWMON can be selected when HWMON=n and THERMAL=n, which fails to build. Signed-off-by: Jan Beulich <jbeulich@novell.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Matthew Garrett <mjg@redhat.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2009-09-19 03:41:10 +08:00
depends on THERMAL
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-25 01:38:56 +08:00
depends on HWMON=y || HWMON=THERMAL
thermal: hide CONFIG_THERMAL_HWMON It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-07-29 04:48:40 +08:00
default y
thermal: add support for thermal sensor present on SPEAr13xx machines ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 03:55:03 +08:00
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
config CPU_THERMAL
bool "generic cpu cooling support"
depends on THERMAL && CPU_FREQ
thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configured Commit 023614183768 ("thermal: add generic cpufreq cooling implementation") requires cpufreq_frequency_get_table(), but that function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the following build error: drivers/built-in.o: In function `cpufreq_get_max_state': drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table' drivers/built-in.o: In function `get_cpu_frequency': drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table' Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration. It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so select it there as well. Signed-off-by: David Rientjes <rientjes@google.com> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-10-16 04:40:15 +08:00
select CPU_FREQ_TABLE
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
help
This implements the generic cpu cooling mechanism through frequency
reduction, cpu hotplug and any other ways of reducing temperature. An
ACPI version of this already exists(drivers/acpi/processor_thermal.c).
This will be useful for platforms using the generic thermal interface
and not the ACPI interface.
If you want this support, you should say Y here.
thermal: add support for thermal sensor present on SPEAr13xx machines ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 03:55:03 +08:00
config SPEAR_THERMAL
bool "SPEAr thermal sensor driver"
depends on THERMAL
depends on PLAT_SPEAR
drivers/thermal/spear_thermal.c: add Device Tree probing capability SPEAr platforms now support DT and so must convert all drivers to support DT. This patch adds DT probing support for SPEAr thermal sensor driver and updates its documentation too. Also, as SPEAr is the only user of this driver and is only available with DT, make this an only DT driver. So, platform_data is completely removed and passed via DT now. Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-05-30 02:18:51 +08:00
depends on OF
thermal: add support for thermal sensor present on SPEAr13xx machines ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 03:55:03 +08:00
help
Enable this to plug the SPEAr thermal sensor driver into the Linux
thermal framework
thermal: add Renesas R-Car thermal sensor support This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-07-21 08:53:48 +08:00
config RCAR_THERMAL
tristate "Renesas R-Car thermal driver"
depends on THERMAL
depends on ARCH_SHMOBILE
help
Enable this to plug the R-Car thermal sensor driver into the Linux
thermal framework
hwmon: exynos4: move thermal sensor driver to driver/thermal directory This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:41 +08:00
config EXYNOS_THERMAL
tristate "Temperature sensor on Samsung EXYNOS"
thermal: exynos5: add exynos5250 thermal sensor driver support Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4 changes are made generic for exynos series. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: SangWook Ju <sw.ju@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:42 +08:00
depends on (ARCH_EXYNOS4 || ARCH_EXYNOS5) && THERMAL
thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configured Commit 023614183768 ("thermal: add generic cpufreq cooling implementation") requires cpufreq_frequency_get_table(), but that function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the following build error: drivers/built-in.o: In function `cpufreq_get_max_state': drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table' drivers/built-in.o: In function `get_cpu_frequency': drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table' Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration. It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so select it there as well. Signed-off-by: David Rientjes <rientjes@google.com> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-10-16 04:40:15 +08:00
select CPU_FREQ_TABLE
hwmon: exynos4: move thermal sensor driver to driver/thermal directory This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:41 +08:00
help
If you say yes here you get support for TMU (Thermal Managment
Unit) on SAMSUNG EXYNOS series of SoC.
Thermal: Introduce fair_share thermal governor This patch introduces a simple 'weight' based governor named fair_share governor. Whenever the thermal framework gets notified of the trip point violation, this governor (if configured), throttles the cooling devices associated with a thermal zone. This mapping between a thermal zone and a cooling device and the effectiveness of cooling are provided in the platform layer. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-18 13:35:01 +08:00
config FAIR_SHARE
bool "Fair-share thermal governor"
depends on THERMAL
help
Enable this to manage platform thermals using fair-share governor.
Thermal: Introduce a step_wise thermal governor This patch adds a simple step_wise governor to the generic thermal layer. This algorithm throttles the cooling devices in a linear fashion. If the 'trend' is heating, it throttles by one step. And if the thermal trend is cooling it de-throttles by one step. This actually moves the throttling logic from thermal_sys.c and puts inside step_wise.c, without any change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-21 14:36:04 +08:00
config STEP_WISE
bool "Step_wise thermal governor"
depends on THERMAL
help
Enable this to manage platform thermals using a simple linear
Thermal: Add a thermal notifier for user space This patch registers a governor which will let the user land manage the platform thermals. Whenever a trip happens, this governor just notifies the user space using kobj_uevent(). Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-18 13:35:03 +08:00
config USER_SPACE
bool "User_space thermal governor"
depends on THERMAL
help
Enable this to let the user space manage the platform thermals.