There was an error in check for the valid temperature in
function temp_to_adc_conversion. The temperature value was
compared with higher limit for less than condition as well,
resulting in returning -EINVAL. Corrected the check condition
to properly check for lower and higher temperature limits.
Signed-off-by: Radhesh Fadnis <radhesh.fadnis@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
While registering the thermal zone, it is required to have the cooling
devices already setup, so that the .bind callback can succeed.
Due to that, the driver code needs to be reorganized so that we first
setup the cooling devices then the zones. This way we cope with the
right thermal framework initialization sequence.
This patch changes the order of the thermal zone initialization,
so that we create it only when the cooling devices are available.
It also adds some defensive checks for the config data, so that
the callbacks are ready for calls when the data is still not
initialized.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
While registering the omap thermal zones we need to
properly specify TC1 and TC2, as long as the proper
passive polling period and monitor period.
This patch fixes the parameters passed while registering
the thermal zone.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch adds the data structures needed for proper registration
of OMAP5 chips. This patch includes definitions for these chip versions:
. OMAP5430
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch adds the data structures needed for proper registration
of OMAP4 chips. This patch includes definitions for these chip versions:
. OMAP4430
. OMAP4460
. OMAP4470
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch has the common thermal framework support for OMAP
bandgap driver. It includes the zone registration and unregistration,
the cpu cooling and the trip definitions.
The trips definition is essentially one trip for passive cooling
using the generic cpu cooling device and another one for thermal
shutdown. The cpu cooling device is built based on the existing
cpu freq table. The build should be agnostic to omap version,
but relies that cpufreq is up and running by the time the driver
registers the cpu cooling, as it relies on the table walk api
from cpufreq.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
In the System Control Module, OMAP supplies a voltage reference
and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
This patch provides a platform driver which expose this feature.
It is moduled as a MFD child of the System Control Module core
MFD driver.
This driver provides only APIs to access the device properties,
like temperature, thresholds and update rate.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: J Keerthy <j-keerthy@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Radhesh Fadnis