Adding brackets allows to multiply the register value,
masked by TS1_RAMP_COEFF_MASK, by an ADJUST value
properly and not to multiply ADJUST by register value and
then mask the whole.
Fixes: 1d693155 ("thermal: add stm32 thermal driver")
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Calling stm_thermal_read_factory_settings before clocking
internal peripheral causes bad register values and makes
temperature computation wrong.
Calling stm_thermal_read_factory_settings inside
stm_thermal_prepare fixes this problem as internal
peripheral is well clocked at this stage.
Fixes: 1d693155 ("thermal: add stm32 thermal driver")
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Without this patch the thermal driver is broken on hi3660.
The dual sensors support patchset was partially merged, unfortunately
the dual thermal zones definition is not available in the DT yet, so
when the driver tries to register all the sensors that fails.
By reducing to 1 the number of sensors on the hi3660, we switch back
to the previous functionnality.
Fixes: 8c6c36846f (thermal/drivers/hisi: Add the dual clusters sensors for hi3660)
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Without this patch, the thermal driver on hi6220 and hi3660 is broken.
That is due because part of the posted patchset was merged but a small
change in the DT was dropped.
The hi6220 and hi3660 do not have an interrupt name in the DT, so
finding interrupt by name fails.
Fix this by returning back to the platform_get_irq() function call.
Fixes: 2cffaeff08 (thermal/drivers/hisi: Use platform_get_irq_byname)
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal_zone_of_device_ops structure can be const as it is only
passed as the last argument of thermal_zone_of_sensor_register
and the corresponding parameter is declared as const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal_zone_of_device_ops structure can be const as it is only
passed as the last argument of devm_thermal_zone_of_sensor_register
and the corresponding parameter is declared as const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When the armada thermal module is inserted, removed and then reinserted,
the system panics as per the messages below. The reason is that "edit"
a live resource in the resource tree twice, and end up with it pointing
to some other hardware.
Editing live resources (resources that are part of the registered
resource tree) is not permissible - the resource tree is an ordered
set of resources, sorted by start address, and when a new resource is
inserted, it is validated that it (a) fits within its parent resource
and (b) does not overlap a neighbouring resource.
Get rid of this resource editing. We can instead adjust the return
value from ioremap() as ioremap() deals with the creation of page-
based mappings - provided the adjustment does not cross a page
boundary.
SError Interrupt on CPU1, code 0xbf000000 -- SError
CPU: 1 PID: 2749 Comm: modprobe Not tainted 4.19.0+ #175
Hardware name: Marvell 8040 MACCHIATOBin Double shot (DT)
pstate: 20400085 (nzCv daIf +PAN -UAO)
pc : regmap_mmio_read+0x3c/0x60
lr : regmap_mmio_read+0x3c/0x60
sp : ffffff800d453900
x29: ffffff800d453900 x28: ffffff800096a1d0
x27: 0000000000000100 x26: ffffff80009696d8
x25: ffffff8000969000 x24: ffffffc13a588918
x23: ffffffc13a9a28a8 x22: ffffff800d4539dc
x21: 0000000000000084 x20: ffffff800d4539dc
x19: ffffffc13a5d5480 x18: 0000000000000000
x17: 0000000000000000 x16: 0000000000000000
x15: 0000000000000000 x14: 0000000000000000
x13: 0000000000000000 x12: 0000000000000030
x11: 0101010101010101 x10: 7f7f7f7f7f7f7f7f
x9 : 0000000000000000 x8 : ffffffc13a5d5a80
x7 : 0000000000000000 x6 : 000000000000003f
x5 : 0000000000000000 x4 : 0000000000000000
x3 : ffffff800851be70 x2 : ffffff800851bd60
x1 : ffffff800d492ff8 x0 : 0000000000000000
Kernel panic - not syncing: Asynchronous SError Interrupt
CPU: 1 PID: 2749 Comm: modprobe Not tainted 4.19.0+ #175
Hardware name: Marvell 8040 MACCHIATOBin Double shot (DT)
Call trace:
dump_backtrace+0x0/0x158
show_stack+0x14/0x1c
dump_stack+0x90/0xb0
panic+0x128/0x298
print_tainted+0x0/0xa8
arm64_serror_panic+0x74/0x80
do_serror+0x5c/0xb8
el1_error+0xb4/0x144
regmap_mmio_read+0x3c/0x60
_regmap_bus_reg_read+0x18/0x20
_regmap_read+0x64/0x180
regmap_read+0x44/0x6c
armada_ap806_init+0x24/0x5c [armada_thermal]
armada_thermal_probe+0x2c8/0x37c [armada_thermal]
platform_drv_probe+0x4c/0xb0
really_probe+0x21c/0x2b4
driver_probe_device+0x58/0xfc
__driver_attach+0xd4/0xd8
bus_for_each_dev+0x50/0xa0
driver_attach+0x20/0x28
bus_add_driver+0x1c4/0x228
driver_register+0x6c/0x124
__platform_driver_register+0x4c/0x54
armada_thermal_driver_init+0x20/0x1000 [armada_thermal]
do_one_initcall+0x30/0x204
do_init_module+0x5c/0x1d4
load_module+0x1a88/0x212c
__se_sys_finit_module+0xa0/0xac
__arm64_sys_finit_module+0x1c/0x24
el0_svc_common+0x94/0xf0
el0_svc_handler+0x24/0x80
el0_svc+0x8/0x3c0
SMP: stopping secondary CPUs
Kernel Offset: disabled
CPU features: 0x0,21806000
Memory Limit: none
Signed-off-by: Russell King <rmk+kernel@armlinux.org.uk>
Tested-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Commit 8c0e64ac40 ("thermal: armada: get rid of the ->is_valid()
pointer") removed the unnecessary indirection through a function
pointer, but in doing so, also removed the negation operator too:
- if (priv->data->is_valid && !priv->data->is_valid(priv)) {
+ if (armada_is_valid(priv)) {
which results in:
armada_thermal f06f808c.thermal: Temperature sensor reading not valid
armada_thermal f2400078.thermal: Temperature sensor reading not valid
armada_thermal f4400078.thermal: Temperature sensor reading not valid
at boot, or whenever the "temp" sysfs file is read. Replace the
negation operator.
Fixes: 8c0e64ac40 ("thermal: armada: get rid of the ->is_valid() pointer")
Signed-off-by: Russell King <rmk+kernel@armlinux.org.uk>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Pull thermal management updates from Zhang Rui:
- Fix a use-after-free issue when unregistering a thermal cooling
device (Dmitry Osipenko)
- use power_efficient_wq for thermal worker to save more power (Jeson
Gao)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
thermal: core: using power_efficient_wq for thermal worker
thermal: core: Fix use-after-free in thermal_cooling_device_destroy_sysfs
Pull thermal SoC updates from Eduardo Valentin:
"Several new things coming up. Specifics:
- Rework of tsens and hisi thermal drivers
- OF-thermal now allows sharing multiple cooling devices on maps
- Added support for r8a7744 and R8A77970 on rcar thermal driver
- Added support for r8a774a1 on rcar_gen3 thermal driver
- New thermal driver stm32
- Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada,
qcom-spmi, rcar, da9062/61"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits)
thermal: da9062/61: Prevent hardware access during system suspend
thermal: rcar_thermal: Prevent doing work after unbind
thermal: rcar_thermal: Prevent hardware access during system suspend
thermal: rcar_gen3_thermal: add R8A77980 support
dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings
thermal: add stm32 thermal driver
dt-bindings: stm32-thermal: add binding documentation
thermal: rcar_thermal: add R8A77970 support
dt-bindings: thermal: rcar-thermal: document R8A77970 bindings
thermal: rcar_thermal: fix duplicate IRQ request
dt-bindings: thermal: rcar: Add device tree support for r8a7744
thermal/drivers/hisi: Add the dual clusters sensors for hi3660
thermal/drivers/hisi: Add more sensors channel
thermal/drivers/hisi: Remove pointless irq field
thermal/drivers/hisi: Use platform_get_irq_byname
thermal/drivers/hisi: Replace macro name with relevant sensor location
thermal/drivers/hisi: Add multiple sensors support
thermal/drivers/hisi: Prepare to support multiple sensors
thermal/drivers/hisi: Factor out the probe functions
thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer
...
The workqueue used for monitoring the hardware may run while the device
is already suspended. Fix this by using the freezable system workqueue
instead, cfr. commit 51e20d0e3a ("thermal: Prevent polling from
happening during system suspend").
Fixes: 608567aac3 ("thermal: da9062/61: Thermal junction temperature monitoring driver")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When testing bind/unbind on r8a7791/koelsch:
WARNING: CPU: 1 PID: 697 at lib/debugobjects.c:329 debug_print_object+0x8c/0xb4
ODEBUG: free active (active state 0) object type: timer_list hint: delayed_work_timer_fn+0x0/0x10
This happens if the workqueue runs after the device has been unbound.
Fix this by cancelling any queued work during remove.
Fixes: e0a5172e9e ("thermal: rcar: add interrupt support")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
On r8a7791/koelsch, sometimes the following message is printed during
system suspend:
rcar_thermal e61f0000.thermal: thermal sensor was broken
This happens if the workqueue runs while the device is already
suspended. Fix this by using the freezable system workqueue instead,
cfr. commit 51e20d0e3a ("thermal: Prevent polling from happening
during system suspend").
Fixes: e0a5172e9e ("thermal: rcar: add interrupt support")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add the R-Car V3H (R8A77980) SoC support to the R-Car gen3 thermal driver.
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add support for DTS thermal sensor that can be
found on some STM32 platforms.
This driver is based on OF and works in interrupt
mode.
It offers two temperature trip points:
passive and critical. The first is intended for
passive cooling notification while the second is
used for over-temperature reset.
Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add the R-Car V3M (R8A77970) SoC support to the R-Car gen2 thermal driver.
The hardware is the same as in the R-Car D3 (R8A77995) plus the CIVM status
register (we don't use).
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The driver on R8A77995 requests the same IRQ twice since
platform_get_resource() is always called for the 1st IRQ resource.
Fixes: 1969d9dc20 ("thermal: rcar_thermal: add r8a77995 support")
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The code is ready to support multiple sensors on the hi3660. The DT
defines a thermal zone per cluster.
Add the little cluster sensor and let it bind with the thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add the sensor channels id for the little, g3d and modem.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The irq field in the data structure is pointless as the scope of its
usage is just to request the interrupt. It can be replaced by a local
variable.
Use the 'ret' variable to get the interrupt number.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
As we have the interrupt names defines, replace platform_get_irq() by
platform_get_irq_byname(), so no confusion can be made when getting
the interrupt with the sensor id.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Change the macro name in order to give a better indication of the
sensor location.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Change the code as it is dealing with several sensors.
For git-bisect compatibility (compilation and booting), assume the DT
is not yet changed and we have a single interrupt.
Next changes will support multiple interrupt sorted by their name.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Convert the 'sensor' field to a pointer and propagate the change in
the file. Havintg a pointer, gives us the opportunity to define
multiple sensors.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The hi6220 and the hi3660 probe functions are doing almost the same
operations, they can share 90% of their code.
Factor out the probe functions by moving the common code in the common
probe function.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Store the sensor pointer in the thermal zone private data and use it
in the callback functions. That allows to continue the conversion to
sensor oriented code where the pointers are the sensors.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In order to support multiple sensors, we have to change the code to
deal with sensors and not the hisi thermal structure.
Add a back pointer to the hisi thermal structure (containerof is not a
good option because later we convert the sensor field to a pointer).
Change the functions parameters to take a sensor instead of this hisi
thermal 'data' structure.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Group the temperature sensor specific ops into a single structure and
assign it to hisi thermal data structure.
Change the platform data pointer to reference the specific sensor ops
instead of the probe functions.
Moving out those allow to split the code to self-encapsulate the
sensor object.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
During probe phase, the error path can be handled in one place and
use goto method to save many duplicated code.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The SROT registers are initialised by the secure firmware at boot. We
don't have write access to the registers. Check if the block is enabled
before continuing.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Registers have moved around across TSENS generations. For example, the
CTRL register was at offset 0x0 in the SROT region on msm8916 but is at
offset 0x4 in newer v2 based TSENS HW blocks.
Allow passing offsets of important registers so that we can continue to
use common functions.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
On platforms whose device trees specify two address spaces for TSENS, the
second one points to the SROT registers. Initialise the SROT map on those
platforms.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The TSENS driver currently only uses a limited set of registers from the TM
address space. So it was ok to map just that set of registers and call it
"map".
We'd now like to map a second set: SROT registers to introduce new
functionality. Rename the "map" field to a more appropriate "tm_map".
The 8960 doesn't have a clear split between TM and SROT registers. To avoid
complicating the data structure, it will switchover to using tm_map for its
maps.
There is no functional change with this patch.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
hw_id is dynamically allocated but not used anywhere. Get rid of dead
code.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The TSENS drivers use a GPL-2.0 license. Replace with equivalent SPDX
tags and delete the full license text.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
We've already converted over the devicetree of platforms using v2
version of the TSENS IP to use two address spaces. Now prepare to
convert over the 8916 and 8974 platforms to use separate SROT and TM
address spaces.
This patch will work with device trees with one or two address spaces
because we set the tm_offset in commit 5b1283984f ("thermal: tsens:
Add support to split up register address space into two").
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In preparation to remove the node name pointer from struct device_node,
convert printf users to use the %pOFn format specifier.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
For SMP systems, thermal worker should use power_efficient_wq in power
saving mode, that will make scheduler more flexible on selecting an active
core for running work handler to avoid keeping work handler always
running on a single core, that will save some power.
Even if 'power_efficient_wq' relevant configs are disabled
'system_freezable_power_efficient_wq' is identical to system_freezable_wq,
behavior is unchanged.
Signed-off-by: Jeson Gao <jeson.gao@unisoc.com>
Signed-off-by: Chunyan Zhang <chunyan.zhang@unisoc.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch fixes use-after-free that was detected by KASAN. The bug is
triggered on a CPUFreq driver module unload by freeing 'cdev' on device
unregister and then using the freed structure during of the cdev's sysfs
data destruction. The solution is to unregister the sysfs at first, then
destroy sysfs data and finally release the cooling device.
Cc: <stable@vger.kernel.org> # v4.17+
Fixes: 8ea229511e ("thermal: Add cooling device's statistics in sysfs")
Signed-off-by: Dmitry Osipenko <digetx@gmail.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Going primarily by:
https://en.wikipedia.org/wiki/List_of_Intel_Atom_microprocessors
with additional information gleaned from other related pages; notably:
- Bonnell shrink was called Saltwell
- Moorefield is the Merriefield refresh which makes it Airmont
The general naming scheme is: FAM6_ATOM_UARCH_SOCTYPE
for i in `git grep -l FAM6_ATOM` ; do
sed -i -e 's/ATOM_PINEVIEW/ATOM_BONNELL/g' \
-e 's/ATOM_LINCROFT/ATOM_BONNELL_MID/' \
-e 's/ATOM_PENWELL/ATOM_SALTWELL_MID/g' \
-e 's/ATOM_CLOVERVIEW/ATOM_SALTWELL_TABLET/g' \
-e 's/ATOM_CEDARVIEW/ATOM_SALTWELL/g' \
-e 's/ATOM_SILVERMONT1/ATOM_SILVERMONT/g' \
-e 's/ATOM_SILVERMONT2/ATOM_SILVERMONT_X/g' \
-e 's/ATOM_MERRIFIELD/ATOM_SILVERMONT_MID/g' \
-e 's/ATOM_MOOREFIELD/ATOM_AIRMONT_MID/g' \
-e 's/ATOM_DENVERTON/ATOM_GOLDMONT_X/g' \
-e 's/ATOM_GEMINI_LAKE/ATOM_GOLDMONT_PLUS/g' ${i}
done
Signed-off-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: Alexander Shishkin <alexander.shishkin@linux.intel.com>
Cc: Arnaldo Carvalho de Melo <acme@redhat.com>
Cc: Jiri Olsa <jolsa@redhat.com>
Cc: Linus Torvalds <torvalds@linux-foundation.org>
Cc: Peter Zijlstra <peterz@infradead.org>
Cc: Stephane Eranian <eranian@google.com>
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: Vince Weaver <vincent.weaver@maine.edu>
Cc: dave.hansen@linux.intel.com
Cc: len.brown@intel.com
Signed-off-by: Ingo Molnar <mingo@kernel.org>
Pull thermal fixes from Eduardo Valentin:
"Minor fixes to OF thermal, qoriq, and rcar drivers"
* 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
thermal: of-thermal: disable passive polling when thermal zone is disabled
thermal: rcar_gen3_thermal: convert to SPDX identifiers
thermal: rcar_thermal: convert to SPDX identifiers
thermal: qoriq: Switch to SPDX identifier
thermal: qoriq: Simplify the 'site' variable assignment
thermal: qoriq: Use devm_thermal_zone_of_sensor_register()
A cooling map entry may now contain a list of phandles and their
arguments representing multiple devices which share the trip point.
This patch updates the thermal OF core to parse them properly. The trip
point and contribution value is shared by multiple cooling devices now
and so a new structure is created, struct __thermal_cooling_bind_param,
which represents a cooling device and its min/max states and the
existing struct __thermal_bind_params now contains an array of this new
cooling device structure.
Tested on Hikey960.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
There are three thermal stages defined in the PMIC:
stage 1: warning
stage 2: system should shut down
stage 3: emergency shut down
By default the PMIC assumes that the OS isn't doing anything and thus
at stage 2 it does a partial PMIC shutdown and at stage 3 it kills
all power. When switching between thermal stages the PMIC generates an
interrupt which is handled by the driver. The partial PMIC shutdown at
stage 2 can be disabled by software, which allows the OS to initiate a
shutdown at stage 2 with a thermal zone configured accordingly.
If a critical trip point is configured in the thermal zone the driver
adjusts the stage 1-3 temperature thresholds to (closely) match the
critical temperature with a stage 2 threshold (125/130/135/140 °C).
If a suitable match is found the partial shutdown at stage 2 is
disabled. If for some reason the system doesn't shutdown at stage 2
the emergency shutdown at stage 3 kicks in.
The partial shutdown at stage 2 remains enabled in these cases:
- no critical trip point defined
- the temperature of the critical trip point is < 125°C
- the temperature of the critical trip point is > 140°C and no
ADC channel is configured (thus the OS is not notified when the critical
temperature is reached)
Suggested-by: Douglas Anderson <dianders@chromium.org>
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Pull thermal management updates from Zhang Rui:
- Add Daniel Lezcano as the reviewer of thermal framework and SoC
driver changes (Daniel Lezcano).
- Fix a bug in intel_dts_soc_thermal driver, which does not translate
IO-APIC GSI (Global System Interrupt) into Linux irq number (Hans de
Goede).
- For device tree bindings, allow cooling devices sharing same trip
point with same contribution value to share cooling map (Viresh
Kumar).
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
dt-bindings: thermal: Allow multiple devices to share cooling map
MAINTAINERS: Add Daniel Lezcano as designated reviewer for thermal
Thermal: Intel SoC DTS: Translate IO-APIC GSI number to linux irq number
Also add these typos to spelling.txt so checkpatch.pl will look for them.
Link: http://lkml.kernel.org/r/88af06b9de34d870cb0afc46cfd24e0458be2575.1529471371.git.fthain@telegraphics.com.au
Signed-off-by: Finn Thain <fthain@telegraphics.com.au>
Cc: Masahiro Yamada <yamada.masahiro@socionext.com>
Cc: Joe Perches <joe@perches.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
David HERNANDEZ SANCHEZ