Commit Graph

7 Commits

Author SHA1 Message Date
Enric Balletbo i Serra 9aa36dfd3d ARM: dts: omap3-igep: Update to use the TI AM/DM37x processor
Most of the boards are using the TI AM/DM37x processor, there is only a small
quantity of IGEP Processor Boards based on TI OMAP3530. So it's better use the
omap36xx.dtsi include instead of omap34xx.dtsi include. We can add support
for the 34xx based variant later on as needed.

To avoid confusion we have added to the model the (TI AM/DM37x) comment.

Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[tony@atomide.com: updated comments for the 34xx to 36xx include change]
Signed-off-by: Tony Lindgren <tony@atomide.com>
2013-11-26 15:03:37 -08:00
Lee Jones fa304a88e7 ARM: dts: Remove '0x's from OMAP3 IGEP0030 DTS file
Cc: Tony Lindgren <tony@atomide.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Benoit Cousson <bcousson@baylibre.com>
2013-10-08 17:51:40 +02:00
Javier Martinez Canillas 78132036da ARM: dts: omap3-igep0030: add mux conf for GPIO LED
The IGEP COM MOdule has a GPIO LED connected to OMAP
pins. Configure this pin as output GPIO.

Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Signed-off-by: Benoit Cousson <bcousson@baylibre.com>
2013-10-08 17:51:39 +02:00
Florian Vaussard 6d624eabcd ARM: dts: OMAP2+: Use existing constants for GPIOs
Use standard GPIO constants to enhance the readability of DT GPIOs.

Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch>
Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
2013-06-18 18:53:38 -05:00
Florian Vaussard 98ef795714 ARM: dts: OMAP2+: Use #include for all device trees
Replace /include/ by #include for OMAP2+ DT, in order to use the
C pre-processor, making use of #define features possible.

Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch>
Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
2013-06-18 18:53:38 -05:00
Javier Martinez Canillas bc6b820d56 ARM: dts: omap3-igep0030: Add NAND flash support
The IGEP COM Module has an 512MB NAND flash memory.

Add a device node for this NAND and its partition layout.

Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
2013-06-18 18:53:36 -05:00
Javier Martinez Canillas 9ad1df2b15 ARM: dts: omap3: Add support for IGEP COM Module
ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.

This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.

Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
2013-04-09 00:16:46 +02:00