This moves the two instances from the big node into two child nodes. The
glue layer ontop does almost nothing.
There is one devices containing the control module for USB (2) phy,
(2) usb and later the dma engine. The usb device is the "glue device"
which contains the musb device as a child. This is what we do ever since.
The new file musb_am335x is just here to prob the new bus and populate
child devices.
There are a lot of changes to the dsps file as a result of the changes:
- musb_core_offset
This is gone. The device tree provides memory ressources information
for the device there is no need to "fix" things
- instances
This is gone as well. If we have two instances then we have have two
child enabled nodes in the device tree. For instance the SoC in beagle
bone has two USB instances but only one has been wired up so there is
no need to load and init the second instance since it won't be used.
- dsps_glue is now per glue device
In the past there was one of this structs but with an array of two and
each instance accessed its variable depending on the platform device
id.
- no unneeded copy of structs
I do not know why struct dsps_musb_wrapper is copied but it is not
necessary. The same goes for musb_hdrc_platform_data which allocated
on demand and then again by platform_device_add_data(). One copy is
enough.
Signed-off-by: Sebastian Andrzej Siewior <bigeasy@linutronix.de>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Sebastian Andrzej Siewior