Commit Graph

3 Commits

Author SHA1 Message Date
Bartlomiej Zolnierkiewicz 9bebf3485c thermal: ti-soc-thermal: remove dead code
Majority of this code (i.e. functions from ti-bandgap.c) has been
introduced in May 2013 by commit eb982001db ("thermal: introduce TI
SoC thermal driver"). Just remove it altogether (in case it is needed
it can be easily resurrected from git repo).

While at it fix incorrect "not used" comments.

Tested-by: Keerthy <j-keerthy@ti.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-07-27 14:43:01 -07:00
Keerthy 13d00b6439 thermal: arm: dra752: Remove all TSHUT related definitions
No configuration needs to be done for TSHUT from software.
Hence remove all the unnecessary definitions.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18 17:44:18 -08:00
Eduardo Valentin 8926fa4f9b thermal: ti-soc-thermal: add thermal data for DRA752 chips
This patch adds the thermal data for TI DRA752 chips.
In this change it includes (autogen):
. Register offset definitions
. Bitfields and masks for all registers
. Conversion table

Also, the thermal limits, thresholds and extrapolation
rules are included. The extrapolation rule is simply
add +2C as margin.

All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined
and exposed. Only MPU has cooling device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:15:52 +08:00