Commit Graph

52 Commits

Author SHA1 Message Date
Amit Daniel Kachhap bb34b4c8cf thermal: exynos: Add extra entries in the tmu platform data
This patch adds entries min_efuse_value, max_efuse_value, default_temp_offset,
trigger_type, cal_type, trim_first_point, trim_second_point, max_trigger_level
trigger_enable in the TMU platform data structure. Also the driver is modified
to use the data passed by these new platform memebers instead of the constant
macros. All these changes helps in separating the SOC specific data part from
the TMU driver.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:52:00 -04:00
Amit Daniel Kachhap 0c1836a656 thermal: exynos: Move exynos_thermal.h from include/* to driver/* folder
This patch renames and moves include/linux/platform_data/exynos_thermal.h to
drivers/thermal/samsung/exynos_tmu.h. This file movement is needed as exynos
SOC's are not supporting non-DT based platforms and this file now just contains
exynos tmu driver related definations.
Also struct freq_clip_table is now moved to exynos_thermal_common.c as it fixes
the compilation issue occuring because now this new tmu header file is included
in tmu driver c file and not in the common thermal header file.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:52:00 -04:00