Majority of this code (i.e. functions from ti-bandgap.c) has been
introduced in May 2013 by commit eb982001db ("thermal: introduce TI
SoC thermal driver"). Just remove it altogether (in case it is needed
it can be easily resurrected from git repo).
While at it fix incorrect "not used" comments.
Tested-by: Keerthy <j-keerthy@ti.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Now that slope and offset data are being passed from
device tree no need to populate in driver data.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add OMAP36xx support to ti-soc-thermal driver. This
chip is also unreliable. The data provided here is
based on OMAP36xx TRM:
http://www.ti.com/lit/ug/swpu177aa/swpu177aa.pdf
Signed-off-by: Eduardo Valentin <edubezva@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This adds support for OMAP3 chips to ti-soc-thermal. As requested by
TI people, it is marked unreliable and warning is printed.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Bartlomiej Zolnierkiewicz