From 0ca010cfdf732f339152b0aada5161a56885eacb Mon Sep 17 00:00:00 2001
From: Christophe de Dinechin <dinechin@redhat.com>
Date: Mon, 18 Mar 2019 11:28:43 +0100
Subject: [PATCH] Release 0.2.3: Address packaging comments

- Address packaging comments made during Fedora packaging review.
- Rebase on a master branch that has fixes for mingw install and macOS test
---
 NEWS | 4 ++++
 1 file changed, 4 insertions(+)

diff --git a/NEWS b/NEWS
index e5a5dd2..40d3c81 100644
--- a/NEWS
+++ b/NEWS
@@ -1,3 +1,7 @@
+v0.2.3          Address packaging review comments
+    
+    See https://bugzilla.redhat.com/show_bug.cgi?id=1689277#c7
+
 v0.2.2          Release 0.2.2: Address packaging issues reported by rpmlint
     
     - Presence of .c files in a non-devel package