54 lines
1.7 KiB
Makefile
54 lines
1.7 KiB
Makefile
#
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# Copyright (C) 2019 The Android Open-Source Project
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#
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# Licensed under the Apache License, Version 2.0 (the "License");
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# you may not use this file except in compliance with the License.
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# You may obtain a copy of the License at
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#
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# http://www.apache.org/licenses/LICENSE-2.0
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#
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# Unless required by applicable law or agreed to in writing, software
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# distributed under the License is distributed on an "AS IS" BASIS,
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# WITHOUT WARRANTIES OR CONDITIONS OF ANY KIND, either express or implied.
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# See the License for the specific language governing permissions and
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# limitations under the License.
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#
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#
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# The makefile contains the special settings for GSI releasing.
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# This makefile is used for the build targets which used for releasing GSI.
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#
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# For example:
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# - Released GSI contains skip_mount.cfg to skip mounting prodcut paritition
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# - Released GSI contains more VNDK packages to support old version vendors
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# - etc.
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#
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# Exclude all files under system/product and system/system_ext
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PRODUCT_ARTIFACT_PATH_REQUIREMENT_WHITELIST += \
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system/product/% \
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system/system_ext/%
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# Split selinux policy
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PRODUCT_FULL_TREBLE_OVERRIDE := true
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# Enable dynamic partition size
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PRODUCT_USE_DYNAMIC_PARTITION_SIZE := true
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# Needed by Pi newly launched device to pass VtsTrebleSysProp on GSI
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PRODUCT_COMPATIBLE_PROPERTY_OVERRIDE := true
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# GSI targets should install "unflattened" APEXes in /system
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TARGET_FLATTEN_APEX := false
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# GSI targets should install "flattened" APEXes in /system_ext as well
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PRODUCT_INSTALL_EXTRA_FLATTENED_APEXES := true
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# GSI specific tasks on boot
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PRODUCT_PACKAGES += \
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gsi_skip_mount.cfg \
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init.gsi.rc
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# Support addtional P and Q VNDK packages
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PRODUCT_EXTRA_VNDK_VERSIONS := 28 29
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