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the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 15:51:08 +08:00
#
# Generic thermal sysfs drivers configuration
#
menuconfig THERMAL
thermal: add the support for building the generic thermal as a module Build the generic thermal driver as module "thermal_sys". Make ACPI thermal, video, processor and fan SELECT the generic thermal driver, as these drivers rely on it to build the sysfs I/F. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-21 16:07:13 +08:00
tristate "Generic Thermal sysfs driver"
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 15:51:08 +08:00
help
Generic Thermal Sysfs driver offers a generic mechanism for
thermal management. Usually it's made up of one or more thermal
zone and cooling device.
ACPI: thermal: syntax, spelling, kernel-doc Reviewed-by: Randy Dunlap <randy.dunlap@oracle.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-08 05:55:08 +08:00
Each thermal zone contains its own temperature, trip points,
the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 15:51:08 +08:00
cooling devices.
All platforms with ACPI thermal support can use this driver.
thermal: add the support for building the generic thermal as a module Build the generic thermal driver as module "thermal_sys". Make ACPI thermal, video, processor and fan SELECT the generic thermal driver, as these drivers rely on it to build the sysfs I/F. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-21 16:07:13 +08:00
If you want this support, you should say Y or M here.
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-25 01:38:56 +08:00
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
if THERMAL
thermal: core: Add a back up thermal shutdown mechanism orderly_poweroff is triggered when a graceful shutdown of system is desired. This may be used in many critical states of the kernel such as when subsystems detects conditions such as critical temperature conditions. However, in certain conditions in system boot up sequences like those in the middle of driver probes being initiated, userspace will be unable to power off the system in a clean manner and leaves the system in a critical state. In cases like these, the /sbin/poweroff will return success (having forked off to attempt powering off the system. However, the system overall will fail to completely poweroff (since other modules will be probed) and the system is still functional with no userspace (since that would have shut itself off). However, there is no clean way of detecting such failure of userspace powering off the system. In such scenarios, it is necessary for a backup workqueue to be able to force a shutdown of the system when orderly shutdown is not successful after a configurable time period. Reported-by: Nishanth Menon <nm@ti.com> Signed-off-by: Keerthy <j-keerthy@ti.com> Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-04-18 12:29:59 +08:00
config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
int "Emergency poweroff delay in milli-seconds"
depends on THERMAL
default 0
help
Thermal subsystem will issue a graceful shutdown when
critical temperatures are reached using orderly_poweroff(). In
case of failure of an orderly_poweroff(), the thermal emergency
poweroff kicks in after a delay has elapsed and shuts down the system.
This config is number of milliseconds to delay before emergency
poweroff kicks in. Similarly to the critical trip point,
the delay should be carefully profiled so as to give adequate
time for orderly_poweroff() to finish on regular execution.
If set to 0 emergency poweroff will not be supported.
In doubt, leave as 0.
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-25 01:38:56 +08:00
config THERMAL_HWMON
thermal: hide CONFIG_THERMAL_HWMON It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-07-29 04:48:40 +08:00
bool
thermal: hwmon: move hwmon support to single file In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-04 03:14:28 +08:00
prompt "Expose thermal sensors as hwmon device"
thermal: Create CONFIG_THERMAL_HWMON=n A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-25 01:38:56 +08:00
depends on HWMON=y || HWMON=THERMAL
thermal: hide CONFIG_THERMAL_HWMON It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-07-29 04:48:40 +08:00
default y
thermal: hwmon: move hwmon support to single file In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-04 03:14:28 +08:00
help
In case a sensor is registered with the thermal
framework, this option will also register it
as a hwmon. The sensor will then have the common
hwmon sysfs interface.
Say 'Y' here if you want all thermal sensors to
have hwmon sysfs interface too.
thermal: add support for thermal sensor present on SPEAr13xx machines ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 03:55:03 +08:00
thermal: introduce device tree parser This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-04 03:35:39 +08:00
config THERMAL_OF
bool
prompt "APIs to parse thermal data out of device tree"
depends on OF
default y
help
This options provides helpers to add the support to
read and parse thermal data definitions out of the
device tree blob.
Say 'Y' here if you need to build thermal infrastructure
based on device tree.
thermal: core: Add Kconfig option to enable writable trips Add a Kconfig option to allow system integrators to control whether userspace tools can change trip temperatures. This option overrides the thermal zone setup in the driver code and must be enabled for platform specified writable trips to come into effect. The original behaviour of requiring root privileges to change trip temperatures remains unchanged. Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-03 18:43:03 +08:00
config THERMAL_WRITABLE_TRIPS
bool "Enable writable trip points"
help
This option allows the system integrator to choose whether
trip temperatures can be changed from userspace. The
writable trips need to be specified when setting up the
thermal zone but the choice here takes precedence.
Say 'Y' here if you would like to allow userspace tools to
change trip temperatures.
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
choice
prompt "Default Thermal governor"
default THERMAL_DEFAULT_GOV_STEP_WISE
help
This option sets which thermal governor shall be loaded at
startup. If in doubt, select 'step_wise'.
config THERMAL_DEFAULT_GOV_STEP_WISE
bool "step_wise"
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
select THERMAL_GOV_STEP_WISE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
help
Use the step_wise governor as default. This throttles the
devices one step at a time.
config THERMAL_DEFAULT_GOV_FAIR_SHARE
bool "fair_share"
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
select THERMAL_GOV_FAIR_SHARE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
help
Use the fair_share governor as default. This throttles the
devices based on their 'contribution' to a zone. The
contribution should be provided through platform data.
config THERMAL_DEFAULT_GOV_USER_SPACE
bool "user_space"
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
select THERMAL_GOV_USER_SPACE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
help
Select this if you want to let the user space manage the
typo in drivers/thermal/Kconfig: lpatform instead of platform Applied to the HEAD of linux.git, VERSION = 3 PATCHLEVEL = 11 SUBLEVEL = 0 Signed-off-by: Regid Ichira <regid23@nt1.in> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-09 05:58:53 +08:00
platform thermals.
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: introduce the Power Allocator governor The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-03 01:17:19 +08:00
config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
bool "power_allocator"
select THERMAL_GOV_POWER_ALLOCATOR
help
Select this if you want to control temperature based on
system and device power allocation. This governor can only
operate on cooling devices that implement the power API.
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
endchoice
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
config THERMAL_GOV_FAIR_SHARE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
bool "Fair-share thermal governor"
help
Enable this to manage platform thermals using fair-share governor.
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
config THERMAL_GOV_STEP_WISE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
bool "Step_wise thermal governor"
help
Enable this to manage platform thermals using a simple linear
thermal: Kconfig: cosmetic fixes Fix typo, finish sentence and add missing dots. Signed-off-by: Luka Perkov <luka@openwrt.org> CC: Randy Dunlap <rdunlap@infradead.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-28 02:20:33 +08:00
governor.
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
thermal: Added Bang-bang thermal governor The bang-bang thermal governor uses a hysteresis to switch abruptly on or off a cooling device. It is intended to control fans, which can not be throttled but just switched on or off. Bang-bang cannot be set as default governor as it is intended for special devices only. For those special devices the driver needs to explicitely request it. Cc: Andrew Morton <akpm@linux-foundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Andreas Mohr <andi@lisas.de> Cc: Borislav Petkov <bp@suse.de> Cc: Javi Merino <javi.merino@arm.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Peter Feuerer <peter@piie.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-22 23:37:13 +08:00
config THERMAL_GOV_BANG_BANG
bool "Bang Bang thermal governor"
default n
help
Enable this to manage platform thermals using bang bang governor.
Say 'Y' here if you want to use two point temperature regulation
used for fans without throttling. Some fan drivers depend on this
governor to be enabled (e.g. acerhdf).
Thermal: rename thermal governor Kconfig option to avoid generic naming Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
config THERMAL_GOV_USER_SPACE
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
bool "User_space thermal governor"
help
Enable this to let the user space manage the platform thermals.
thermal: introduce the Power Allocator governor The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-03-03 01:17:19 +08:00
config THERMAL_GOV_POWER_ALLOCATOR
bool "Power allocator thermal governor"
help
Enable this to manage platform thermals by dynamically
allocating and limiting power to devices.
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
config CPU_THERMAL
Thermal: build cpu_cooling code into thermal_sys module Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-03-26 23:57:01 +08:00
bool "generic cpu cooling support"
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
depends on CPU_FREQ
thermal: cpu_cooling: introduce of_cpufreq_cooling_register This patch introduces an API to register cpufreq cooling device based on device tree node. The registration via device tree node differs from normal registration due to the fact that it is needed to fill the device_node structure in order to be able to match the cooling devices with trip points. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-13 07:26:45 +08:00
depends on THERMAL_OF
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
help
This implements the generic cpu cooling mechanism through frequency
thermal: cpu_cooling: update Kconfig entry There is no support for hotplug or any other means of reducing temperature. So, this patch removes these references from Kconfig. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-18 01:12:10 +08:00
reduction. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c).
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
This will be useful for platforms using the generic thermal interface
and not the ACPI interface.
thermal: cpu_cooling: update Kconfig entry There is no support for hotplug or any other means of reducing temperature. So, this patch removes these references from Kconfig. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-18 01:12:10 +08:00
thermal: add generic cpufreq cooling implementation This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:40 +08:00
If you want this support, you should say Y here.
thermal: introduce clock cooling device This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Mike Turquette <mturquette@linaro.org> Cc: Nishanth Menon <nm@ti.com> Cc: Pavel Machek <pavel@ucw.cz> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Cc: Len Brown <len.brown@intel.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-01-06 21:04:18 +08:00
config CLOCK_THERMAL
bool "Generic clock cooling support"
depends on COMMON_CLK
depends on PM_OPP
help
This entry implements the generic clock cooling mechanism through
frequency clipping. Typically used to cool off co-processors. The
device that is configured to use this cooling mechanism will be
controlled to reduce clock frequency whenever temperature is high.
thermal: Add devfreq cooling Add a generic thermal cooling device for devfreq, that is similar to cpu_cooling. The device must use devfreq. In order to use the power extension of the cooling device, it must have registered its OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Ørjan Eide <orjan.eide@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-11 01:09:30 +08:00
config DEVFREQ_THERMAL
bool "Generic device cooling support"
depends on PM_DEVFREQ
depends on PM_OPP
help
This implements the generic devfreq cooling mechanism through
frequency reduction for devices using devfreq.
This will throttle the device by limiting the maximum allowed DVFS
frequency corresponding to the cooling level.
In order to use the power extensions of the cooling device,
devfreq should use the simple_ondemand governor.
thermal: introduce clock cooling device This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Mike Turquette <mturquette@linaro.org> Cc: Nishanth Menon <nm@ti.com> Cc: Pavel Machek <pavel@ucw.cz> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Cc: Len Brown <len.brown@intel.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-01-06 21:04:18 +08:00
If you want this support, you should say Y here.
thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation This patch adds support to set the emulated temperature method in thermal zone (sensor). After setting this feature thermal zone may report this temperature and not the actual temperature. The emulation implementation may be based on sensor capability through platform specific handler or pure software emulation if no platform handler defined. This is useful in debugging different temperature threshold and its associated cooling action. Critical threshold's cannot be emulated. Writing 0 on this node should disable emulation. Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-04 08:30:15 +08:00
config THERMAL_EMULATION
bool "Thermal emulation mode support"
help
Enable this option to make a emul_temp sysfs node in thermal zone
directory to support temperature emulation. With emulation sysfs node,
user can manually input temperature and test the different trip
threshold behaviour for simulation purpose.
thermal: add a warning for temperature emulation feature Because this feature is for debuging purposes, it is highly recommended to do not enable this on production systems. This patch adds warnings for system integrators, so that people are aware of this potential security issue. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-27 05:38:34 +08:00
WARNING: Be careful while enabling this option on production systems,
because userland can easily disable the thermal policy by simply
flooding this sysfs node with low temperature values.
thermal: hisilicon: add new hisilicon thermal sensor driver This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-20 19:16:37 +08:00
config HISI_THERMAL
tristate "Hisilicon thermal driver"
thermal: hisilicon: fix for dependency The thermal driver is standalone driver which is used to enable thermal sensors, so it can be used with any cooling device and should not bind with CPU cooling device driver. This original patch is suggested by Amit Kucheria; so it's to polish the dependency in Kconfig, and remove the dependency with CPU_THERMAL. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-08-31 16:50:16 +08:00
depends on ARCH_HISI || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 09:03:59 +08:00
depends on HAS_IOMEM
thermal: hisilicon: fix for dependency The thermal driver is standalone driver which is used to enable thermal sensors, so it can be used with any cooling device and should not bind with CPU cooling device driver. This original patch is suggested by Amit Kucheria; so it's to polish the dependency in Kconfig, and remove the dependency with CPU_THERMAL. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-08-31 16:50:16 +08:00
depends on OF
default y
thermal: hisilicon: add new hisilicon thermal sensor driver This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-20 19:16:37 +08:00
help
Enable this to plug hisilicon's thermal sensor driver into the Linux
thermal framework. cpufreq is used as the cooling device to throttle
CPUs when the passive trip is crossed.
thermal: add imx thermal driver support This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 14:30:44 +08:00
config IMX_THERMAL
tristate "Temperature sensor driver for Freescale i.MX SoCs"
thermal: imx: depend on imx SoC arch Not much use unless the SoC is selected so depend on the ARCH_MXC and COMPILE_TEST like all the other thermal drivers. v2: drop extraneous OF Signed-off-by: Peter Robinson <pbrobinson@gmail.com> Acked-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-05-25 21:45:50 +08:00
depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
thermal: add imx thermal driver support This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 14:30:44 +08:00
depends on MFD_SYSCON
depends on OF
help
Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
It supports one critical trip point and one passive trip point. The
cpufreq is used as the cooling device to throttle CPUs when the
passive trip is crossed.
thermal: max77620: Add thermal driver for reporting junction temp Maxim Semiconductor Max77620 supports alarm interrupts when its die temperature crosses 120C and 140C. These threshold temperatures are not configurable. Add thermal driver to register PMIC die temperature as thermal zone sensor and capture the die temperature warning interrupts to notifying the client. Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-08-23 16:20:27 +08:00
config MAX77620_THERMAL
tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
depends on MFD_MAX77620
depends on OF
help
Support for die junction temperature warning alarm for Maxim
Semiconductor PMIC MAX77620 device. Device generates two alarm
interrupts when PMIC die temperature cross the threshold of
120 degC and 140 degC.
thermal: qoriq: Add thermal management support This driver add thermal management support by enabling TMU (Thermal Monitoring Unit) on QorIQ platform. It's based on thermal of framework: - Trip points defined in device tree. - Cpufreq as cooling device registered in qoriq cpufreq driver. Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-06-30 11:08:38 +08:00
config QORIQ_THERMAL
tristate "QorIQ Thermal Monitoring Unit"
depends on THERMAL_OF
depends on HAS_IOMEM
help
Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
It supports one critical trip point and one passive trip point. The
cpufreq is used as the cooling device to throttle CPUs when the
passive trip is crossed.
thermal: add support for thermal sensor present on SPEAr13xx machines ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 03:55:03 +08:00
config SPEAR_THERMAL
thermal: allow spear-thermal driver to be a module When the thermal subsystem is a loadable module, the spear driver fails to build: drivers/thermal/built-in.o: In function `spear_thermal_exit': spear_thermal.c:(.text+0xf8): undefined reference to `thermal_zone_device_unregister' drivers/thermal/built-in.o: In function `spear_thermal_probe': spear_thermal.c:(.text+0x230): undefined reference to `thermal_zone_device_register' This changes the symbol to a tristate, so Kconfig can track the dependency correctly. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-01-26 00:44:11 +08:00
tristate "SPEAr thermal sensor driver"
thermal: spear: allow compile test Adding COMPILE_TEST flag to spear driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 11:42:01 +08:00
depends on PLAT_SPEAR || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 09:03:59 +08:00
depends on HAS_IOMEM
drivers/thermal/spear_thermal.c: add Device Tree probing capability SPEAr platforms now support DT and so must convert all drivers to support DT. This patch adds DT probing support for SPEAr thermal sensor driver and updates its documentation too. Also, as SPEAr is the only user of this driver and is only available with DT, make this an only DT driver. So, platform_data is completely removed and passed via DT now. Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-05-30 02:18:51 +08:00
depends on OF
thermal: add support for thermal sensor present on SPEAr13xx machines ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 03:55:03 +08:00
help
Enable this to plug the SPEAr thermal sensor driver into the Linux
thermal: Kconfig: cosmetic fixes Fix typo, finish sentence and add missing dots. Signed-off-by: Luka Perkov <luka@openwrt.org> CC: Randy Dunlap <rdunlap@infradead.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-28 02:20:33 +08:00
thermal framework.
thermal: add Renesas R-Car thermal sensor support This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-07-21 08:53:48 +08:00
thermal: rockchip: add driver for thermal Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 12:58:59 +08:00
config ROCKCHIP_THERMAL
tristate "Rockchip thermal driver"
thermal: rockchip: allow compile test Adding COMPILE_TEST flag to rockchip driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Heiko Stuebner <heiko@sntech.de> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-rockchip@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 11:43:57 +08:00
depends on ARCH_ROCKCHIP || COMPILE_TEST
thermal: rockchip: add driver for thermal Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 12:58:59 +08:00
depends on RESET_CONTROLLER
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 09:03:59 +08:00
depends on HAS_IOMEM
thermal: rockchip: add driver for thermal Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 12:58:59 +08:00
help
Rockchip thermal driver provides support for Temperature sensor
ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
trip point. Cpufreq is used as the cooling device and will throttle
CPUs when the Temperature crosses the passive trip point.
thermal: add Renesas R-Car thermal sensor support This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-07-21 08:53:48 +08:00
config RCAR_THERMAL
tristate "Renesas R-Car thermal driver"
thermal: rcar: Use ARCH_RENESAS Make use of ARCH_RENESAS in place of ARCH_SHMOBILE. This is part of an ongoing process to migrate from ARCH_SHMOBILE to ARCH_RENESAS the motivation for which being that RENESAS seems to be a more appropriate name than SHMOBILE for the majority of Renesas ARM based SoCs. Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-02 10:04:26 +08:00
depends on ARCH_RENESAS || COMPILE_TEST
thermal,rcar_thermal: Add dependency on HAS_IOMEM Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST) broke build on archs wihout io memory. On archs like S390 or um this driver cannot build nor work. Make it depend on HAS_IOMEM to bypass build failures. drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource' drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource' Signed-off-by: Richard Weinberger <richard@nod.at> Acked-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com> Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-01-27 16:40:58 +08:00
depends on HAS_IOMEM
thermal: add Renesas R-Car thermal sensor support This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-07-21 08:53:48 +08:00
help
Enable this to plug the R-Car thermal sensor driver into the Linux
thermal: Kconfig: cosmetic fixes Fix typo, finish sentence and add missing dots. Signed-off-by: Luka Perkov <luka@openwrt.org> CC: Randy Dunlap <rdunlap@infradead.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-28 02:20:33 +08:00
thermal framework.
hwmon: exynos4: move thermal sensor driver to driver/thermal directory This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-08-16 19:41:41 +08:00
thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver Add support for R-Car Gen3 thermal sensors. Polling only for now, interrupts will be added incrementally. Same goes for reading fuses. This is documented already, but no hardware available for now. Signed-off-by: Hien Dang <hien.dang.eb@renesas.com> Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com> Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com> Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> [Niklas: document and rework temperature calculation] Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-12-22 18:38:21 +08:00
config RCAR_GEN3_THERMAL
tristate "Renesas R-Car Gen3 thermal driver"
depends on ARCH_RENESAS || COMPILE_TEST
depends on HAS_IOMEM
depends on OF
help
Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux
thermal framework.
thermal: Add support for the thermal sensor on Kirkwood SoCs This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:35:24 +08:00
config KIRKWOOD_THERMAL
tristate "Temperature sensor on Marvell Kirkwood SoCs"
thermal: kirkwood: allow compile test Adding COMPILE_TEST flag to kirkwood driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 11:44:46 +08:00
depends on MACH_KIRKWOOD || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 09:03:59 +08:00
depends on HAS_IOMEM
thermal: Add support for the thermal sensor on Kirkwood SoCs This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:35:24 +08:00
depends on OF
help
Support for the Kirkwood thermal sensor driver into the Linux thermal
framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
Thermal: Dove: Add Themal sensor support for Dove. The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:35:26 +08:00
config DOVE_THERMAL
tristate "Temperature sensor on Marvell Dove SoCs"
thermal: dove: allow compile test Adding COMPILE_TEST flag to dove driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 11:45:25 +08:00
depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 09:03:59 +08:00
depends on HAS_IOMEM
Thermal: Dove: Add Themal sensor support for Dove. The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:35:26 +08:00
depends on OF
help
Support for the Dove thermal sensor driver in the Linux thermal
framework.
Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 18:56:42 +08:00
config DB8500_THERMAL
thermal: allow u8500-thermal driver to be a module When the thermal subsystem is a loadable module, the u8500 driver fails to build: drivers/thermal/built-in.o: In function `db8500_thermal_probe': db8500_thermal.c:(.text+0x96c): undefined reference to `thermal_zone_device_register' drivers/thermal/built-in.o: In function `db8500_thermal_work': db8500_thermal.c:(.text+0xab4): undefined reference to `thermal_zone_device_update' This changes the symbol to a tristate, so Kconfig can track the dependency correctly. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-01-26 00:44:12 +08:00
tristate "DB8500 thermal management"
depends on MFD_DB8500_PRCMU
Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 18:56:42 +08:00
default y
help
Adds DB8500 thermal management implementation according to the thermal
management framework. A thermal zone with several trip points will be
created. Cooling devices can be bound to the trip points to cool this
thermal zone if trip points reached.
thermal: Add driver for Armada 370/XP SoC thermal management This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 09:37:41 +08:00
config ARMADA_THERMAL
tristate "Armada 370/XP thermal management"
thermal: armada: allow compile test Adding COMPILE_TEST flag to armada driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 11:48:00 +08:00
depends on ARCH_MVEBU || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 09:03:59 +08:00
depends on HAS_IOMEM
thermal: Add driver for Armada 370/XP SoC thermal management This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 09:37:41 +08:00
depends on OF
help
Enable this option if you want to have support for thermal management
controller present in Armada 370 and Armada XP SoC.
thermal: da9062/61: Thermal junction temperature monitoring driver Add junction temperature monitoring supervisor device driver, compatible with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added. If the PMIC's internal junction temperature rises above T_WARN (125 degC) an interrupt is issued. This T_WARN level is defined as the THERMAL_TRIP_HOT trip-wire inside the device driver. The thermal triggering mechanism is interrupt based and happens when the temperature rises above a given threshold level. The component cannot return an exact temperature, it only has knowledge if the temperature is above or below a given threshold value. A status bit must be polled to detect when the temperature falls below that threshold level again. A kernel work queue is configured to repeatedly poll and detect when the temperature falls below this trip-wire, between 1 and 10 second intervals (defaulting at 3 seconds). This scheme is provided as an example. It would be expected that any final implementation will also include a notify() function and any of these settings could be altered to match the application where appropriate. When over-temperature is reached, the interrupt from the DA9061/2 will be repeatedly triggered. The IRQ is therefore disabled when the first over-temperature event happens and the status bit is polled using a work-queue until it becomes false. This strategy is designed to allow the periodic transmission of uevents (HOT trip point) as the first level of temperature supervision method. It is intended for non-invasive temperature control, where the necessary measures for cooling the system down are left to the host software. Once the temperature falls again, the IRQ is re-enabled so a new critical over-temperature event can be detected. Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-28 22:43:33 +08:00
config DA9062_THERMAL
tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
depends on MFD_DA9062 || COMPILE_TEST
depends on OF
help
Enable this for the Dialog Semiconductor thermal sensor driver.
This will report PMIC junction over-temperature for one thermal trip
zone.
Compatible with the DA9062 and DA9061 PMICs.
PM: Introduce Intel PowerClamp Driver Intel PowerClamp driver performs synchronized idle injection across all online CPUs. The goal is to maintain a given package level C-state ratio. Compared to other throttling methods already exist in the kernel, such as ACPI PAD (taking CPUs offline) and clock modulation, this is often more efficient in terms of performance per watt. Please refer to Documentation/thermal/intel_powerclamp.txt for more details. Signed-off-by: Arjan van de Ven <arjan@linux.intel.com> Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-21 20:37:57 +08:00
config INTEL_POWERCLAMP
tristate "Intel PowerClamp idle injection driver"
depends on THERMAL
depends on X86
depends on CPU_SUP_INTEL
help
Enable this to enable Intel PowerClamp idle injection driver. This
enforce idle time which results in more package C-state residency. The
user interface is exposed via generic thermal framework.
Thermal: CPU Package temperature thermal This driver register CPU digital temperature sensor as a thermal zone at package level. Each package will show up as one zone with at max two trip points. These trip points can be both read and updated. Once a non zero value is set in the trip point, if the package package temperature goes above or below this setting, a thermal notification is generated. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-18 07:42:02 +08:00
config X86_PKG_TEMP_THERMAL
tristate "X86 package temperature thermal driver"
thermal: fix x86_pkg_temp_thermal.c build and Kconfig Fix build error in x86_pkg_temp_thermal.c. It requires that X86_MCE & X86_THERMAL_VECTOR be enabled, so depend on the latter symbol, since it depends on X86_MCE (indirectly). Also, X86_PKG_TEMP_THERMAL is already inside an "if THERMAL" block, so remove that duplicated dependency. ERROR: "platform_thermal_package_rate_control" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined! ERROR: "platform_thermal_package_notify" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined! Signed-off-by: Randy Dunlap <rdunlap@infradead.org> Acked-by: Borislav Petkov <bp@suse.de> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-18 03:27:17 +08:00
depends on X86_THERMAL_VECTOR
Thermal: CPU Package temperature thermal This driver register CPU digital temperature sensor as a thermal zone at package level. Each package will show up as one zone with at max two trip points. These trip points can be both read and updated. Once a non zero value is set in the trip point, if the package package temperature goes above or below this setting, a thermal notification is generated. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-18 07:42:02 +08:00
select THERMAL_GOV_USER_SPACE
thermal: kconfig: select THERMAL_WRITABLE_TRIPS for x86 thermal After the commit "thermal: core: Add Kconfig option to enable writable trips", by default the trips are read only. This cause user space thermal controllers to poll for temperature as they can't set temperature thresholds for getting a notification via uevents. These programs use RW trip in a zone to register thresholds. Since we need to enable the new config introduced by above commit to allow writable trips, selecting CONFIG_THERMAL_WRITABLE_TRIP for x86 thermal drivers. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-08-03 19:13:16 +08:00
select THERMAL_WRITABLE_TRIPS
Thermal: CPU Package temperature thermal This driver register CPU digital temperature sensor as a thermal zone at package level. Each package will show up as one zone with at max two trip points. These trip points can be both read and updated. Once a non zero value is set in the trip point, if the package package temperature goes above or below this setting, a thermal notification is generated. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-18 07:42:02 +08:00
default m
help
Enable this to register CPU digital sensor for package temperature as
thermal zone. Each package will have its own thermal zone. There are
two trip points which can be set by user to get notifications via thermal
notification methods.
Thermal: Intel SoC: DTS thermal IOSF core This is becoming a common feature for Intel SoCs to expose the additional digital temperature sensors (DTSs) using side band interface (IOSF). This change remove common IOSF DTS handler function from the existing driver intel_soc_dts_thermal.c and creates a stand alone module, which can be selected from the SoC specific drivers. In this way there is less code duplication. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-03-03 05:12:58 +08:00
config INTEL_SOC_DTS_IOSF_CORE
tristate
depends on X86
select IOSF_MBI
help
This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
implements the common set of helper functions to register, get temperature
and get/set thresholds on DTSs.
thermal: Intel SoC DTS thermal In the Intel SoCs like Bay Trail, there are 2 additional digital temperature sensors(DTS), in addition to the standard DTSs in the core. Also they support 4 programmable thresholds, out of which two can be used by OSPM. These thresholds can be used by OSPM thermal control. Out of these two thresholds, one is used by driver and one user mode can change via thermal sysfs to get notifications on threshold violations. The driver defines one critical trip points, which is set to TJ MAX - offset. The offset can be changed via module parameter (default 5C). Also it uses one of the thresholds to get notification for this temperature violation. This is very important for orderly shutdown as the many of these devices don't have ACPI thermal zone, and expects that there is some other thermal control mechanism present in OSPM. When a Linux distro is used without additional specialized thermal control program, BIOS can do force shutdown when thermals are not under control. When temperature reaches critical, the Linux thermal core will initiate an orderly shutdown. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-04-08 04:57:15 +08:00
config INTEL_SOC_DTS_THERMAL
tristate "Intel SoCs DTS thermal driver"
Thermal: Intel SoC: DTS thermal use common APIs There is no change in functionality but using the common IOSF core APIs. This driver is now just responsible for enumeration and call relevant API to create thermal zone and register critical trip. Also cpuid 0x4c is now handled in the int340x processor thermal driver with the same functionality. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-03-03 05:12:59 +08:00
depends on X86
select INTEL_SOC_DTS_IOSF_CORE
thermal: kconfig: select THERMAL_WRITABLE_TRIPS for x86 thermal After the commit "thermal: core: Add Kconfig option to enable writable trips", by default the trips are read only. This cause user space thermal controllers to poll for temperature as they can't set temperature thresholds for getting a notification via uevents. These programs use RW trip in a zone to register thresholds. Since we need to enable the new config introduced by above commit to allow writable trips, selecting CONFIG_THERMAL_WRITABLE_TRIP for x86 thermal drivers. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-08-03 19:13:16 +08:00
select THERMAL_WRITABLE_TRIPS
thermal: Intel SoC DTS thermal In the Intel SoCs like Bay Trail, there are 2 additional digital temperature sensors(DTS), in addition to the standard DTSs in the core. Also they support 4 programmable thresholds, out of which two can be used by OSPM. These thresholds can be used by OSPM thermal control. Out of these two thresholds, one is used by driver and one user mode can change via thermal sysfs to get notifications on threshold violations. The driver defines one critical trip points, which is set to TJ MAX - offset. The offset can be changed via module parameter (default 5C). Also it uses one of the thresholds to get notification for this temperature violation. This is very important for orderly shutdown as the many of these devices don't have ACPI thermal zone, and expects that there is some other thermal control mechanism present in OSPM. When a Linux distro is used without additional specialized thermal control program, BIOS can do force shutdown when thermals are not under control. When temperature reaches critical, the Linux thermal core will initiate an orderly shutdown. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-04-08 04:57:15 +08:00
help
Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
temperature sensor (DTS). These SoCs have two additional DTSs in
addition to DTSs on CPU cores. Each DTS will be registered as a
thermal zone. There are two trip points. One of the trip point can
be set by user mode programs to get notifications via Linux thermal
notification methods.The other trip is a critical trip point, which
was set by the driver based on the TJ MAX temperature.
thermal: intel Quark SoC X1000 DTS thermal driver In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS). The DTS offers both hot & critical trip points. However, in current distribution of UEFI BIOS for Quark platform, only critical trip point is configured to be 105 degree Celsius (based on Quark SW ver1.0.1 and hot trip point is not used due to lack of IRQ. There is no active cooling device for Quark SoC, so Quark SoC thermal management logic expects Linux distro to orderly power-off when temperature of the DTS exceeds the configured critical trip point. Kernel param "polling_delay" in milliseconds is used to control the frequency the DTS temperature is read by thermal framework. It defaults to 2-second. To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X". User interacts with Quark SoC DTS thermal driver through sysfs via: /sys/class/thermal/thermal_zone0/ For example: - to read DTS temperature $ cat temp - to read critical trip point $ cat trip_point_0_temp - to read trip point type $ cat trip_point_0_type - to emulate temperature raise to test orderly shutdown by Linux distro $ echo 105 > emul_temp Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie> Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com> Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie> Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-04-15 10:08:15 +08:00
config INTEL_QUARK_DTS_THERMAL
tristate "Intel Quark DTS thermal driver"
depends on X86_INTEL_QUARK
help
Enable this to register Intel Quark SoC (e.g. X1000) platform digital
temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
The DTS will be registered as a thermal zone. There are two trip points:
hot & critical. The critical trip point default value is set by
underlying BIOS/Firmware.
Thermal / ACPI / video: add INT3406 thermal driver INT3406 ACPI device object resembles an ACPI video output device, but its _BCM is said to be deprecated and should not be used. So we will make use of the raw interface to do the actual cooling. Signed-off-by: Aaron Lu <aaron.lu@intel.com> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2016-05-09 15:54:58 +08:00
menu "ACPI INT340X thermal drivers"
source drivers/thermal/int340x_thermal/Kconfig
endmenu
Thermal: int340x_thermal: expose acpi thermal relationship tables ACPI 4.0 introduced two thermal relationship tables via _ART (active cooling) and _TRT (passive cooling) objects. These tables contain many to many relationships among thermal sensors and cooling devices. This patch parses _ART and _TRT and makes the result available to the userspace via an misc device interface. At the same time, kernel drivers can also request parsing results from internal kernel APIs. The results include source and target devices, influence, and sampling rate in case of _TRT. For _ART, the result shows source device, target device, and weight percentage. Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-09-03 15:14:23 +08:00
thermal: add Intel BXT WhiskeyCove PMIC thermal driver This change adds support for Intel BXT Whiskey Cove PMIC thermal driver which is intended to handle the alert interrupts triggered upon thermal trip point cross and notify the thermal framework appropriately with the zone, temp, crossed trip and event details. Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com> Signed-off-by: Bin Gao <bin.gao@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-08-30 00:55:04 +08:00
config INTEL_BXT_PMIC_THERMAL
tristate "Intel Broxton PMIC thermal driver"
mfd: intel_soc_pmic: Fix a mess with compilation units Crystal Cove and Whiskey Cove are two different PMICs which are installed on Intel Atom SoC based platforms. Moreover there are two independent drivers that by some reason were supposed (*) to get into one kernel module. Fix the mess by clarifying Kconfig option for Crystal Cove and split Whiskey Cove out of it. (*) It looks like the configuration was never tested with INTEL_SOC_PMIC=n. The line in Makefile is actually wrong. Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> (supporter:ACPI) Acked-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com> Signed-off-by: Lee Jones <lee.jones@linaro.org>
2017-04-04 20:38:56 +08:00
depends on X86 && INTEL_SOC_PMIC_BXTWC && REGMAP
thermal: add Intel BXT WhiskeyCove PMIC thermal driver This change adds support for Intel BXT Whiskey Cove PMIC thermal driver which is intended to handle the alert interrupts triggered upon thermal trip point cross and notify the thermal framework appropriately with the zone, temp, crossed trip and event details. Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com> Signed-off-by: Bin Gao <bin.gao@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-08-30 00:55:04 +08:00
help
Select this driver for Intel Broxton PMIC with ADC channels monitoring
system temperature measurements and alerts.
This driver is used for monitoring the ADC channels of PMIC and handles
the alert trip point interrupts and notifies the thermal framework with
the trip point and temperature details of the zone.
thermal: Add Intel PCH thermal driver This change adds a thermal driver for Wildcat Point platform controller hub. This driver register PCH thermal sensor as a thermal zone and associate critical and hot trips if present. Signed-off-by: Tushar Dave <tushar.n.dave@intel.com> Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-06-11 04:34:24 +08:00
config INTEL_PCH_THERMAL
tristate "Intel PCH Thermal Reporting Driver"
depends on X86 && PCI
help
Enable this to support thermal reporting on certain intel PCHs.
Thermal reporting device will provide temperature reading,
programmable trip points and other information.
thermal: Add Mediatek thermal controller support This adds support for the Mediatek thermal controller found on MT8173 and likely other SoCs. The controller is a bit special. It does not have its own ADC, instead it controls the on-SoC AUXADC via AHB bus accesses. For this reason we need the physical address of the AUXADC. Also it controls a mux using AHB bus accesses, so we need the APMIXEDSYS physical address aswell. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-11-30 19:42:32 +08:00
config MTK_THERMAL
tristate "Temperature sensor driver for mediatek SoCs"
depends on ARCH_MEDIATEK || COMPILE_TEST
thermal: mtk: allow compile testing on UM Following the fix on thermal Kconfig, this patch adds dependency on HAS_IOMEM so driver properly compile test on UM arch. Cc: Krzysztof Kozlowski <k.kozlowski@samsung.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Matthias Brugger <matthias.bgg@gmail.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-mediatek@lists.infradead.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-09 05:32:48 +08:00
depends on HAS_IOMEM
thermal: fix mtk_thermal build dependency Fix build errors when MTK_THERMAL=y and NVMEM=m by preventing that Kconfig combination. drivers/built-in.o: In function `mtk_thermal_probe': mtk_thermal.c:(.text+0xffa8f): undefined reference to `nvmem_cell_get' mtk_thermal.c:(.text+0xffabe): undefined reference to `nvmem_cell_read' mtk_thermal.c:(.text+0xffac9): undefined reference to `nvmem_cell_put' Signed-off-by: Randy Dunlap <rdunlap@infradead.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: <linux-pm@vger.kernel.org> Cc: Sascha Hauer <s.hauer@pengutronix.de> Cc: Hanyi Wu <hanyi.wu@mediatek.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-04-20 00:44:23 +08:00
depends on NVMEM || NVMEM=n
thermal: fix Mediatek thermal controller build At least with CONFIG_COMPILE_TEST, there's no reason to assume that CONFIG_RESET_CONTROLLER is set, but the code for this controller requires it since it calls device_reset(). Make CONFIG_MTK_THERMAL properly depend on CONFIG_RESET_CONTROLLER. Signed-off-by: Johannes Berg <johannes.berg@intel.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-04-14 21:15:20 +08:00
depends on RESET_CONTROLLER
thermal: Add Mediatek thermal controller support This adds support for the Mediatek thermal controller found on MT8173 and likely other SoCs. The controller is a bit special. It does not have its own ADC, instead it controls the on-SoC AUXADC via AHB bus accesses. For this reason we need the physical address of the AUXADC. Also it controls a mux using AHB bus accesses, so we need the APMIXEDSYS physical address aswell. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-11-30 19:42:32 +08:00
default y
help
Enable this option if you want to have support for thermal management
controller present in Mediatek SoCs
thermal: broadcom: add Northstar thermal driver Northstar is a SoC family commonly used in home routers. This commit adds a driver for checking CPU temperature. As Northstar Plus seems to also have this IP block this new symbol gets ARCH_BCM_IPROC dependency. Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Jon Mason <jon.mason@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-03 23:48:29 +08:00
menu "Broadcom thermal drivers"
depends on ARCH_BCM || COMPILE_TEST
source "drivers/thermal/broadcom/Kconfig"
endmenu
thermal: introduce TI SoC thermal driver This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-15 23:46:00 +08:00
menu "Texas Instruments thermal drivers"
thermal: ti-soc: Kconfig fix to avoid menu showing wrongly Move the dependencies to menu, so we avoid showing it wrongly. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-omap@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 12:13:41 +08:00
depends on ARCH_HAS_BANDGAP || COMPILE_TEST
thermal: Fix build error of missing devm_ioremap_resource on UM The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-04 09:03:59 +08:00
depends on HAS_IOMEM
thermal: introduce TI SoC thermal driver This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-15 23:46:00 +08:00
source "drivers/thermal/ti-soc-thermal/Kconfig"
endmenu
Merge branch 'cpu-package-thermal' of .git into next Conflicts: drivers/thermal/Kconfig drivers/thermal/Makefile
2013-06-18 06:31:26 +08:00
thermal: exynos: Moving exynos thermal files into samsung directory This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 18:50:22 +08:00
menu "Samsung thermal drivers"
thermal: exynos: allow compile test Adding COMPILE_TEST flag to exynos driver to facilitate maintenance. Cc: Lukasz Majewski <l.majewski@samsung.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-10 11:53:35 +08:00
depends on ARCH_EXYNOS || COMPILE_TEST
thermal: exynos: Moving exynos thermal files into samsung directory This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 18:50:22 +08:00
source "drivers/thermal/samsung/Kconfig"
endmenu
thermal: sti: Introduce ST Thermal core code This core is shared by both ST's 'memory mapped' and 'system configuration register' based Thermal controllers. Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com> Signed-off-by: Lee Jones <lee.jones@linaro.org> Acked-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-06-05 23:06:55 +08:00
menu "STMicroelectronics thermal drivers"
depends on ARCH_STI && OF
source "drivers/thermal/st/Kconfig"
endmenu
thermal: add temperature sensor support for tango SoC The Tango thermal driver provides support for the primitive temperature sensor embedded in Tango chips since the SMP8758. This sensor only generates a 1-bit signal to indicate whether the die temperature exceeds a programmable threshold. Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-04-19 22:21:16 +08:00
config TANGO_THERMAL
tristate "Tango thermal management"
depends on ARCH_TANGO || COMPILE_TEST
help
Enable the Tango thermal driver, which supports the primitive
temperature sensor embedded in Tango chips since the SMP8758.
This sensor only generates a 1-bit signal to indicate whether
the die temperature exceeds a programmable threshold.
thermal: tegra: move tegra thermal files into tegra directory Move Tegra soctherm driver to tegra directory, it's easy to maintain and add more new function support for Tegra platforms. This will also help to split soctherm driver into common parts and chip specific data related parts. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-29 18:29:11 +08:00
source "drivers/thermal/tegra/Kconfig"
thermal: Add QPNP PMIC temperature alarm driver Add support for the temperature alarm peripheral found inside Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm peripheral outputs a pulse on an interrupt line whenever the thermal over temperature stage value changes. Register a thermal sensor. The temperature reported by this thermal sensor device should reflect the actual PMIC die temperature if an ADC is present on the given PMIC. If no ADC is present, then the reported temperature should be estimated from the over temperature stage value. Cc: David Collins <collinsd@codeaurora.org> Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-02-06 01:12:56 +08:00
config QCOM_SPMI_TEMP_ALARM
tristate "Qualcomm SPMI PMIC Temperature Alarm"
Revert "thermal: qcom_spmi: allow compile test" This just caused build errors: warning: (QCOM_SPMI_TEMP_ALARM) selects REGMAP_SPMI which has unmet direct dependencies (SPMI) drivers/built-in.o: In function `regmap_spmi_ext_gather_write': :(.text+0x609b0): undefined reference to `spmi_ext_register_write' :(.text+0x609f0): undefined reference to `spmi_ext_register_writel' While it's generally a good idea to allow compile testing, in this case, it just doesn't work, so reverting the patch that introduced the compile-test variant seems the most appropriate solution. Note that SPMI also has a 'depends on ARCH_QCOM || COMPILE_TEST' statement, so we should be able to enable SPMI on all architectures for compile testing already. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Fixes: cb7fb4d34202 ("thermal: qcom_spmi: allow compile test") Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-11-17 05:43:50 +08:00
depends on OF && SPMI && IIO
thermal: Add QPNP PMIC temperature alarm driver Add support for the temperature alarm peripheral found inside Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm peripheral outputs a pulse on an interrupt line whenever the thermal over temperature stage value changes. Register a thermal sensor. The temperature reported by this thermal sensor device should reflect the actual PMIC die temperature if an ADC is present on the given PMIC. If no ADC is present, then the reported temperature should be estimated from the over temperature stage value. Cc: David Collins <collinsd@codeaurora.org> Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-02-06 01:12:56 +08:00
select REGMAP_SPMI
help
This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
PMIC devices. It shows up in sysfs as a thermal sensor with multiple
trip points. The temperature reported by the thermal sensor reflects the
real time die temperature if an ADC is present or an estimate of the
temperature based upon the over temperature stage value.
thermal: generic-adc: Add ADC based thermal sensor driver In some of platform, thermal sensors like NCT thermistors are connected to the one of ADC channel. The temperature is read by reading the voltage across the sensor resistance via ADC. Lookup table for ADC read value to temperature is referred to get temperature. ADC is read via IIO framework. Add support for thermal sensor driver which read the voltage across sensor resistance from ADC through IIO framework. Acked-by: Jonathan Cameron <jic23@kernel.org> Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-04-19 15:22:01 +08:00
config GENERIC_ADC_THERMAL
tristate "Generic ADC based thermal sensor"
depends on IIO
help
This enabled a thermal sysfs driver for the temperature sensor
which is connected to the General Purpose ADC. The ADC channel
is read via IIO framework and the channel information is provided
to this driver. This driver reports the temperature by reading ADC
channel and converts it to temperature based on lookup table.
thermal: qcom: tsens: Add a skeletal TSENS drivers TSENS is Qualcomms' thermal temperature sensor device. It supports reading temperatures from multiple thermal sensors present on various QCOM SoCs. Calibration data is generally read from a non-volatile memory (eeprom) device. Add a skeleton driver with all the necessary abstractions so a variety of qcom device families which support TSENS can add driver extensions. Also add the required device tree bindings which can be used to describe the TSENS device in DT. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Reviewed-by: Lina Iyer <lina.iyer@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-05-05 16:51:39 +08:00
menu "Qualcomm thermal drivers"
depends on (ARCH_QCOM && OF) || COMPILE_TEST
source "drivers/thermal/qcom/Kconfig"
endmenu
thermal: zx2967: add thermal driver for ZTE's zx2967 family This patch adds thermal driver for ZTE's zx2967 family. Signed-off-by: Baoyou Xie <baoyou.xie@linaro.org> Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-07 08:56:41 +08:00
config ZX2967_THERMAL
tristate "Thermal sensors on zx2967 SoC"
depends on ARCH_ZX || COMPILE_TEST
help
Enable the zx2967 thermal sensors driver, which supports
the primitive temperature sensor embedded in zx2967 SoCs.
This sensor generates the real time die temperature.
Refactor drivers/thermal/Kconfig Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 09:16:20 +08:00
endif