Some systems register thermal zone by themself and don't need to
have thermal zones node in DT. Therefore reduce the log level from
ERROR to DEBUG when thermal zone node can't be find in
of_thermal_destroy_zones().
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal code uses int, long and unsigned long for temperatures
in different places.
Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.
'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.
Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Darren Hart <dvhart@linux.intel.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Reviewed-by: Peter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In order to avoid having each driver adding their own
specific DT property to specify slope and offset,
this patch adds a basic coefficient reading from
DT thermal zone node. Right now, as the thermal
framework does not support multiple sensors,
the current coefficients apply only to the only
sensor in the thermal zone.
The supported equation is a simple linear model:
slope * <sensor reading> + offset.
slope and offset are read from the coefficients
DT property. In the same way as it is described in
the DT thermal binding.
So, as of today, the thermal framework will support
only cases like:
/* hotspot = 1 * adc + 6000 */
coefficients = <1 6000>;
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When registering a thermal zone from device tree, default the trip
points to writable. By default, only the root user can change these.
This allows the trip points to be tweaked after the system has
booted.
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.
If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.
Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.
While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Up till now the thermal_zone mode was by default "disabled". With this
patch the default behavior was changed to "enable".
One can read the mode at:
/sys/class/thermal/thermal_zone0/mode
Tested-by: Javi Merino <javi.merino@arm.com>
Reported-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
With gcc 4.1.2, 4.2, and 4.2.4 (4.4 and later are OK):
drivers/thermal/thermal_core.h:110: warning: type qualifiers ignored on function return type
Signed-off-by: Geert Uytterhoeven <geert@linux-m68k.org>
Fixes: ce8be77859 ("thermal: of: Extend of-thermal to export table of trip points")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Before this change it was only possible to set get_temp() and get_trend()
methods to be used in the common code handling passing parameters via
device tree to "cpu-thermal" CPU thermal zone device.
Now it is possible to also set emulated value of temperature for debug
purposes.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch extends the of-thermal.c to export trip points for a given
thermal zone.
Thermal drivers should use of_thermal_get_trip_points() method to get
pointer to table of thermal trip points.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch changes name of struct __thermal_trip to thermal_trip and moves
declaration of the latter to ./include/linux/thermal.h for better visibility.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch extends the of-thermal.c to provide check if trip point is
valid.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch extends the of-thermal.c to provide information about number of
available trip points.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Different drivers request API extensions in of-thermal. For this reason,
additional callbacks are required to fit the new drivers needs.
The current API implementation expects the registering sensor driver
to provide a get_temp and get_trend callbacks as function parameters.
As the amount of callbacks is growing, this patch changes the existing
implementation to use a .ops field to hold all the of thermal callbacks
to sensor drivers.
This patch also changes the existing of-thermal users to fit the new
API design. No functional change is introduced in this patch.
Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Jean Delvare <jdelvare@suse.de>
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Cc: lm-sensors@lm-sensors.org
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Tested-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Alexandre Courbot <acourbot@nvidia.com>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Here on function return all temporarily used device nodes shall
decrement their usage counter. The problems are found with device
nodes allocated by for_each_child_of_node(), of_parse_phandle()
and of_find_node_by_name(), fix all problems at once.
Signed-off-by: Vladimir Zapolskiy <vz@mleia.com>
Cc: devicetree@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add support to check status of the thermal zone before registering the
zone. This will help on disabling some non-existing thermal zone from
the top level DTS file out of common dtsi thermalzone file.
For example,
we have 3 platforms almost same but thermal zones on this platform are
little bit different. Platform 1 and 2 have three thermal zones and
platform 3 has two thermal zones. To avoid duplication of the thermal
zones entries on each DTS file of platforms,we created one common
dtsi file for thermal zone and included this dtsi file from these
3 platform's top level dts file.
On common thermal zone com dtsi file, all thermal zone are enabled and
need to disable one of thermal zone on platform 3 dts file. For this, we
just added entry status = "disabled" for that thermal zone on platform 3
dts file and along with this change to make it work.
This way, we reuse the common file and control the enable/disable of the
thermal zone from top level dts file.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When binding cooling devices to thermal zones created from the device
tree the minimum and maximum cooling states are in the wrong order
leading to failure to bind.
Fix the order of cooling states in the call to
thermal_zone_bind_cooling_device to fix this.
Cc:Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Reviewed-by: Stephen Boyd <sboyd@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
It looks like this code is missing braces, otherwise the if
statement shouldn't have been indented. Fix it.
Signed-off-by: Stephen Boyd <sboyd@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.
This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.
This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.
Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Jiada Wang