Commit Graph

8 Commits

Author SHA1 Message Date
Anatolij Gustschin 3df0045325 usb: fix building musb drivers
Commit 3dacdf11 "usb: factor out state_string() on otg drivers"
broke building musb drivers since there is already another
otg_state_string() function in musb drivers, but with different
prototype. Fix musb drivers to use common otg_state_string(), too.

Also provide a nop for otg_state_string() if CONFIG_USB_OTG_UTILS
is not defined.

Signed-off-by: Anatolij Gustschin <agust@denx.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
2011-05-06 18:16:39 -07:00
Felipe Balbi 92b48df24e usb: musb: drop board_set_vbus
that's not used anymore. So let's drop it.

Signed-off-by: Felipe Balbi <balbi@ti.com>
2010-12-10 10:21:33 +02:00
Felipe Balbi 0349176120 usb: musb: move clock handling to glue layer
musb core doesn't need to know about platform
specific details. So start moving clock
handling to platform glue layer and make
musb core agnostic about that.

Signed-off-by: Felipe Balbi <balbi@ti.com>
2010-12-10 10:21:24 +02:00
Felipe Balbi f7ec94370f usb: musb: pass platform_ops via platform_data
... then we don't need to export any symbols
from glue layer to musb_core.

Signed-off-by: Felipe Balbi <balbi@ti.com>
2010-12-10 10:21:23 +02:00
Felipe Balbi e6480faa10 usb: musb: da8xx: give it a context structure
that structure currently only holds a device
pointer to our own platform_device and musb's
platform_device, but soon it will hold pointers
to our clock structures and glue-specific bits
and pieces.

Signed-off-by: Felipe Balbi <balbi@ti.com>
2010-12-10 10:21:21 +02:00
Felipe Balbi 8ceae51ed5 usb: musb: split da8xx to its own platform_driver
Just adding its own platform_driver, not really
using it yet.

When all HW glue layers are converted, more patches
will come to split power management code from musb_core
and move it completely to HW glue layer.

Signed-off-by: Felipe Balbi <balbi@ti.com>
2010-12-10 10:21:16 +02:00
Felipe Balbi 743411b3f3 usb: musb: make all glue layer export struct musb_platform_ops
preparing to a big refactor on musb code. We need
to be able to compile in all glue layers (or at
least all ARM-based ones) together and have a
working binary.

While preparing for that, we move every glue
layer to export only one symbol, which is
a struct musb_platform_ops, and make all
other functions static.

Later patches will come to allow for compiling
all glue layers together and have a working
binary.

Signed-off-by: Felipe Balbi <balbi@ti.com>
2010-12-07 09:19:39 +02:00
Sergei Shtylyov 3ee076dea6 usb: musb: introduce DA8xx/OMAP-L1x glue layer
Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.

Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
2010-10-22 10:21:52 -07:00