Commit Graph

6 Commits

Author SHA1 Message Date
Wei Ni 6f7e0d9d08 thermal: tegra: combine sensor group-related data
Combine sensor group-related data structures into struct
tegra_tsensor_group. This provides a single location for
sensor group data storage.
More sensor group data will be added in subsequent patches.

Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:27 -07:00
Lukasz Majewski f5576e3a9e thermal: exynos: Provide thermal_exynos.h file to be included in device tree files
This patch is a preparatory patch to be able to read Exynos thermal
configuration from the device tree.

It turned out that DTC is not able to interpret enums properly and hence
it is necessary to #define those values explicitly.

For this reason the ./include/dt-bindings/thermal/thermal_exynos.h file
has been introduced.

Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-01-24 17:30:22 -04:00
Zhang Rui 32c9edc4e3 Merge branch 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc 2014-12-21 22:49:12 +08:00
Punit Agrawal a940cb34fe thermal: Fix cdev registration with THERMAL_NO_LIMIT on 64bit
The size of unsigned long varies between 32 and 64 bit systems while
the size of phandle arguments is always 32 bits per parameter.

On 64-bit systems, cooling devices registered via of-thermal apis fail
to bind when the min/max cooling state is specified as
THERMAL_NO_LIMIT (-1UL) as there is a mis-match between the value read
from the device tree (32bit) and the pre-processor define (64bit).

As we're unlikely to need cooling states larger than 32 bits, and for
consistency with the size of phandle arguments, explicitly limit
THERMAL_NO_LIMIT to 32 bits.

Reported-by: Hyungwoo Yang <hwoo.yang@gmail.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-10 11:11:00 -04:00
Mikko Perttunen 0199e9938f of: Add bindings for nvidia,tegra124-soctherm
This adds binding documentation and headers for the Tegra124
SOCTHERM device tree node.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Stephen Warren <swarren@nvidia.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:43:17 -04:00
Eduardo Valentin 4e5e4705bf thermal: introduce device tree parser
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:31:34 -04:00