The IGEP COM MOdule has a GPIO LED connected to OMAP
pins. Configure this pin as output GPIO.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Signed-off-by: Benoit Cousson <bcousson@baylibre.com>
Use standard GPIO constants to enhance the readability of DT GPIOs.
Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch>
Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
Replace /include/ by #include for OMAP2+ DT, in order to use the
C pre-processor, making use of #define features possible.
Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch>
Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
The IGEP COM Module has an 512MB NAND flash memory.
Add a device node for this NAND and its partition layout.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.
This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
Lee Jones