Adjust the reg property to fix the following warning seen with
'make dt_binding_check':
Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml: example-0: thermal@42050000:reg:0: [0, 1107623936, 0, 604] is too long
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20200630122527.28640-1-festevam@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
Remove the soc unit address to fix the following warnings seen with
'make dt_binding_check':
Documentation/devicetree/bindings/thermal/thermal-sensor.example.dts:22.20-49.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property
Documentation/devicetree/bindings/thermal/thermal-zones.example.dts:23.20-50.11: Warning (unit_address_vs_reg): /example-0/soc@0: node has a unit name, but no reg or ranges property
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20200630121804.27887-1-festevam@gmail.com
[robh: also fix thermal-zones.yaml example]
Signed-off-by: Rob Herring <robh@kernel.org>
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device (Matthias
Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error handling
(Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC
thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the change
the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace module.h by
export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal driver
(Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the int340x
thermal driver - trivial conflicts fixed (Matthew Garrett)
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Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add the hwmon support on the i.MX SC (Anson Huang)
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device
(Matthias Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error
handling (Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the
TI SoC thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the
change the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit
Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace
module.h by export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal
driver (Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the
int340x thermal driver - trivial conflicts fixed (Matthew Garrett)
* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
thermal/int340x_thermal: Don't require IDSP to exist
thermal/int340x_thermal: Export OEM vendor variables
thermal/int340x_thermal: Export GDDV
thermal: qoriq: Update the settings for TMUv2
thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
thermal: qoriq: Add platform dependencies
drivers: thermal: tsens: Merge tsens-common.c into tsens.c
thermal/of: Rename of-thermal.c
thermal/governors: Prefix all source files with gov_
thermal/drivers/user_space: Sort headers alphabetically
thermal/drivers/of-thermal: Sort headers alphabetically
thermal/drivers/cpufreq_cooling: Replace module.h with export.h
thermal/drivers/cpufreq_cooling: Sort headers alphabetically
thermal/drivers/clock_cooling: Include export.h
thermal/drivers/clock_cooling: Sort headers alphabetically
thermal/drivers/thermal_hwmon: Include export.h
thermal/drivers/thermal_hwmon: Sort headers alphabetically
thermal/drivers/thermal_helpers: Include export.h
thermal/drivers/thermal_helpers: Sort headers alphabetically
thermal/core: Replace module.h with export.h
...
Another round of 'allOf' removals that came in this cycle.
json-schema versions draft7 and earlier have a weird behavior in that
any keywords combined with a '$ref' are ignored (silently). The correct
form was to put a '$ref' under an 'allOf'. This behavior is now changed
in the 2019-09 json-schema spec and '$ref' can be mixed with other
keywords. The json-schema library doesn't yet support this, but the
tooling now does a fixup for this and either way works.
This has been a constant source of review comments, so let's change this
treewide so everyone copies the simpler syntax.
Signed-off-by: Rob Herring <robh@kernel.org>
Add thermal sensor support for r8a7742 SoC. The Renesas RZ/G1H
(r8a7742) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Marian-Cristian Rotariu <marian-cristian.rotariu.rb@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the i.MX thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Rob Herring <robh@kernel.org>
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The thermal-zone binding is a software abstraction to capture the
properties of each zone - how often they should be checked, the
temperature thresholds (trips) at which mitigation actions need to be
taken and the level of mitigation needed at those thresholds.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/44e5c68bc654ccaf88945f70dc875fa186dd1480.1585748882.git.amit.kucheria@linaro.org
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The property #cooling-cells is required in each device that acts as a
cooling device - whether active or passive. So any device that can
throttle its performance to passively reduce heat dissipation (e.g.
CPUs, GPUs) and any device that can actively dissipate heat at different
levels (e.g. fans) will contain this property.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/7a9ead7fb67585fb70ab3ffd481e7d567e96970e.1585748882.git.amit.kucheria@linaro.org
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The property #thermal-sensor-cells is required in each device that acts
as a thermal sensor. It is used to uniquely identify the instance of the
thermal sensor inside the system.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/a91b5603caea5b8854cc9f5325448e4c7228c328.1585748882.git.amit.kucheria@linaro.org
Some devices are not able to cool down by reducing their voltage /
frequency because it could be not available or the system does not
allow voltage scaling. In this configuration, it is not possible to
use this strategy and the idle injection cooling device can be used
instead.
One idle cooling device is now present for the CPU as implemented by
the combination of the idle injection framework belonging to the power
capping framework and the thermal cooling device. The missing part is
the DT binding providing a way to describe how the cooling device will
work on the system.
A first iteration was done by making the cooling device to point to
the idle state. Unfortunately it does not make sense because it would
need to duplicate the idle state description for each CPU in order to
have a different phandle and make the thermal internal framework
happy.
It was proposed to add an cooling-cells to <3>, unfortunately the
thermal framework is expecting a value of <2> as stated by the
documentation and it is not possible from the cooling device generic
code to loop this third value to the back end cooling device.
Another proposal was to add a child 'thermal-idle' node as the SCMI
does. This approach allows to have a self-contained configuration for
the idle cooling device without colliding with the cpufreq cooling
device which is based on the CPU node. In addition, it allows to have
the cpufreq cooling device and the idle cooling device to co-exist
together as shown in the example.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200429103644.5492-2-daniel.lezcano@linaro.org
The examples template is a 'simple-bus' with a size of 1 cell for
had between 2 and 4 cells which really only errors on I2C or SPI type
devices with a single cell.
The easiest fix in most cases is to change the 'reg' property to for 1 cell
address and size. In some cases with child devices having 2 cells, that
doesn't make sense so a bus node is needed.
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rob Herring <robh@kernel.org>
Convert the i.MX8MM thermal binding to DT schema format using json-schema
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Rob Herring <robh@kernel.org>
json-schema versions draft7 and earlier have a weird behavior in that
any keywords combined with a '$ref' are ignored (silently). The correct
form was to put a '$ref' under an 'allOf'. This behavior is now changed
in the 2019-09 json-schema spec and '$ref' can be mixed with other
keywords. The json-schema library doesn't yet support this, but the
tooling now does a fixup for this and either way works.
This has been a constant source of review comments, so let's change this
treewide so everyone copies the simpler syntax.
Scripted with ruamel.yaml with some manual fixups. Some minor whitespace
changes from the script.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Maxime Ripard <mripard@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Acked-by: Wolfram Sang <wsa@the-dreams.de> # for I2C
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio
Reviewed-by: Stephen Boyd <sboyd@kernel.org> # clock
Signed-off-by: Rob Herring <robh@kernel.org>
Fix various inconsistencies in schema indentation. Most of these are
list indentation which should be 2 spaces more than the start of the
enclosing keyword. This doesn't matter functionally, but affects running
scripts which do transforms on the schema files.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Maxime Ripard <mripard@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Signed-off-by: Rob Herring <robh@kernel.org>
Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 AM654 supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-2-j-keerthy@ti.com
- Add interrupt support on the rcar sensor (Niklas Söderlund)
- Add a new Spreadtrum thermal driver (Baolin Wang)
- Add thermal binding for the fsl scu board, a new API to retrieve the
sensor id bound to the thermal zone and i.MX system controller
sensor (Anson Huang))
- Remove warning log when a deferred probe is requested on Exynos
(Marek Szyprowski)
- Add the thermal monitoring unit support for imx8mm with its DT
bindings (Anson Huang)
- Rephrase the Kconfig text for clarity (Linus Walleij)
- Use the gpio descriptor for the ti-soc-thermal (Linus Walleij)
- Align msg structure to 4 bytes for i.MX SC, fix the Kconfig
dependency, add the __may_be unused annotation for PM functions and
the COMPILE_TEST option for imx8mm (Anson Huang)
- Fix a dependency on regmap in Kconfig for qoriq (Yuantian Tang)
- Add DT binding and support for the rcar gen3 r8a77961 and improve
the error path on the rcar init function (Niklas Söderlund)
- Cleanup and improvements for the tsens Qcom sensor (Amit Kucheria)
- Improve code by removing lock and caching values in the rcar thermal
sensor (Niklas Söderlund)
- Cleanup in the qoriq drivers and add a call to
imx_thermal_unregister_legacy_cooling in the removal function (Anson
Huang)
- Remove redundant 'maxItems' in tsens and sprd DT bindings (Rob Herring)
- Change the thermal DT bindings by making the cooling-maps optional
(Yuantian Tang)
- Add Tiger Lake support (Sumeet Pawnikar)
- Use scnprintf() for avoiding potential buffer overflow (Takashi Iwai)
- Make pkg_temp_lock a raw_spinlock_t(Clark Williams)
- Fix incorrect data types by changing them to signed on i.MX SC (Anson Huang)
- Replace zero-length array with flexible-array member (Gustavo A. R. Silva)
- Add support for i.MX8MP in the driver and in the DT bindings (Anson Huang)
- Fix return value of the cpufreq_set_cur_state() function (Willy Wolff)
- Remove abusing and scary WARN_ON in the cpufreq cooling device
(Daniel Lezcano)
- Fix build warning of incorrect argument type reported by sparse on
imx8mm (Anson Huang)
- Fix stub for the devfreq cooling device (Martin Blumenstingl)
- Fix cpu idle cooling documentation (Sergey Vidishev)
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Merge tag 'thermal-v5.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Convert tsens configuration DT binding to yaml (Rajeshwari)
- Add interrupt support on the rcar sensor (Niklas Söderlund)
- Add a new Spreadtrum thermal driver (Baolin Wang)
- Add thermal binding for the fsl scu board, a new API to retrieve the
sensor id bound to the thermal zone and i.MX system controller sensor
(Anson Huang))
- Remove warning log when a deferred probe is requested on Exynos
(Marek Szyprowski)
- Add the thermal monitoring unit support for imx8mm with its DT
bindings (Anson Huang)
- Rephrase the Kconfig text for clarity (Linus Walleij)
- Use the gpio descriptor for the ti-soc-thermal (Linus Walleij)
- Align msg structure to 4 bytes for i.MX SC, fix the Kconfig
dependency, add the __may_be unused annotation for PM functions and
the COMPILE_TEST option for imx8mm (Anson Huang)
- Fix a dependency on regmap in Kconfig for qoriq (Yuantian Tang)
- Add DT binding and support for the rcar gen3 r8a77961 and improve the
error path on the rcar init function (Niklas Söderlund)
- Cleanup and improvements for the tsens Qcom sensor (Amit Kucheria)
- Improve code by removing lock and caching values in the rcar thermal
sensor (Niklas Söderlund)
- Cleanup in the qoriq drivers and add a call to
imx_thermal_unregister_legacy_cooling in the removal function (Anson
Huang)
- Remove redundant 'maxItems' in tsens and sprd DT bindings (Rob
Herring)
- Change the thermal DT bindings by making the cooling-maps optional
(Yuantian Tang)
- Add Tiger Lake support (Sumeet Pawnikar)
- Use scnprintf() for avoiding potential buffer overflow (Takashi Iwai)
- Make pkg_temp_lock a raw_spinlock_t(Clark Williams)
- Fix incorrect data types by changing them to signed on i.MX SC (Anson
Huang)
- Replace zero-length array with flexible-array member (Gustavo A. R.
Silva)
- Add support for i.MX8MP in the driver and in the DT bindings (Anson
Huang)
- Fix return value of the cpufreq_set_cur_state() function (Willy
Wolff)
- Remove abusing and scary WARN_ON in the cpufreq cooling device
(Daniel Lezcano)
- Fix build warning of incorrect argument type reported by sparse on
imx8mm (Anson Huang)
- Fix stub for the devfreq cooling device (Martin Blumenstingl)
- Fix cpu idle cooling documentation (Sergey Vidishev)
* tag 'thermal-v5.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (52 commits)
Documentation: cpu-idle-cooling: Fix diagram for 33% duty cycle
thermal: devfreq_cooling: inline all stubs for CONFIG_DEVFREQ_THERMAL=n
thermal: imx8mm: Fix build warning of incorrect argument type
thermal/drivers/cpufreq_cooling: Remove abusing WARN_ON
thermal/drivers/cpufreq_cooling: Fix return of cpufreq_set_cur_state
thermal: imx8mm: Add i.MX8MP support
dt-bindings: thermal: imx8mm-thermal: Add support for i.MX8MP
thermal: qcom: tsens.h: Replace zero-length array with flexible-array member
thermal: imx_sc_thermal: Fix incorrect data type
thermal: int340x_thermal: Use scnprintf() for avoiding potential buffer overflow
thermal: int340x: processor_thermal: Add Tiger Lake support
thermal/x86_pkg_temp: Make pkg_temp_lock a raw_spinlock_t
dt-bindings: thermal: make cooling-maps property optional
dt-bindings: thermal: qcom-tsens: Remove redundant 'maxItems'
dt-bindings: thermal: sprd: Remove redundant 'maxItems'
thermal: imx: Calling imx_thermal_unregister_legacy_cooling() in .remove
thermal: qoriq: Sort includes alphabetically
thermal: qoriq: Use devm_add_action_or_reset() to handle all cleanups
thermal: rcar_thermal: Remove lock in rcar_thermal_get_current_temp()
thermal: rcar_thermal: Do not store ctemp in rcar_thermal_priv
...
Ensure the node only contains the properties listed in the schema by
setting 'additionalProperties: false'. Doing this requires reworking the
interrupt properties schemas so that they are defined in the main
'properties' section.
Fixes: a877e768f6 ("dt-bindings: thermal: tsens: Convert over to a yaml schema")
Cc: Andy Gross <agross@kernel.org>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Amit Kucheria <amit.kucheria@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
There's a typo 'nvmem-cells-names' in the schema which means the correct
'nvmem-cell-names' in the examples are not checked. The possible values
are wrong too both in that the 2nd entry is not specified correctly and the
values are just wrong based on the dts files in the kernel.
Fixes: a877e768f6 ("dt-bindings: thermal: tsens: Convert over to a yaml schema")
Cc: Andy Gross <agross@kernel.org>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Amit Kucheria <amit.kucheria@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Setting 'additionalProperties: false' is frequently omitted, but is
important in order to check that there aren't extra undocumented
properties in a binding.
Ideally, we'd just add this automatically and make this the default, but
there's some cases where it doesn't work. For example, if a common
schema is referenced, then properties in the common schema aren't part
of what's considered for 'additionalProperties'. Also, sometimes there
are bus specific properties such as 'spi-max-frequency' that go into
bus child nodes, but aren't defined in the child node's schema.
So let's stick with the json-schema defined default and add
'additionalProperties: false' where needed. This will be a continual
review comment and game of wack-a-mole.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Alexandru Ardelean <alexandru.ardelean@analog.com>
Reviewed-by: Benjamin Gaignard <benjamin.gaignard@st.com>
Acked-by: Stephen Boyd <sboyd@kernel.org> # clock
Acked-by: Lee Jones <lee.jones@linaro.org>
Numerous schemas are missing 'additionalProperties: false' statements which
ensures a binding doesn't have any extra undocumented properties or child
nodes. Fixing this reveals various missing properties, so let's fix all
those occurrences.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Acked-by: Alexandru Ardelean <alexandru.ardelean@analog.com>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for-iio
Acked-by: Stephen Boyd <sboyd@kernel.org> # clock
Acked-by: Lee Jones <lee.jones@linaro.org>
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Cc: dri-devel@lists.freedesktop.org
Cc: netdev@vger.kernel.org
Cc: Guillaume La Roque <glaroque@baylibre.com>
Cc: linux-arm-kernel@lists.infradead.org
Cc: Mark Brown <broonie@kernel.org>
Cc: linux-iio@vger.kernel.org
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: linux-clk@vger.kernel.org
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: Kevin Hilman <khilman@baylibre.com>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: Hartmut Knaack <knaack.h@gmx.de>
Cc: Peter Meerwald-Stadler <pmeerw@pmeerw.net>
Cc: linux-amlogic@lists.infradead.org
Cc: linux-pm@vger.kernel.org
Cc: Masahiro Yamada <yamada.masahiro@socionext.com>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Liam Girdwood <lgirdwood@gmail.com>
Cc: Mauro Carvalho Chehab <mchehab@kernel.org>
Cc: linux-gpio@vger.kernel.org
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-media@vger.kernel.org
Cc: Lee Jones <lee.jones@linaro.org>
Cooling-maps doesn't have to be a required property because there may
be no cooling device on system, or there are no enough cooling devices for
each thermal zone in multiple thermal zone cases since cooling devices
can't be shared.
So make this property optional to remove such limitations.
For thermal zones with no cooling-maps, there could be critic trips
that can trigger CPU reset or shutdown. So they still can take actions.
Signed-off-by: Yuantian Tang <andy.tang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200309045411.21859-1-andy.tang@nxp.com
There's no need to specify 'maxItems' with the same value as the number
of entries in 'items'. A meta-schema update will catch future cases.
Cc: Andy Gross <agross@kernel.org>
Cc: Bjorn Andersson <bjorn.andersson@linaro.org>
Cc: Amit Kucheria <amit.kucheria@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200313214552.845-2-robh@kernel.org
There's no need to specify 'maxItems' with the same value as the number
of entries in 'items'. A meta-schema update will catch future cases.
Cc: Orson Zhai <orsonzhai@gmail.com>
Cc: Baolin Wang <baolin.wang7@gmail.com>
Cc: Chunyan Zhang <zhang.lyra@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amit.kucheria@verdurent.com>
Cc: linux-pm@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200313214552.845-1-robh@kernel.org
Several DT references got broken due to txt->yaml conversion.
Those are auto-fixed by running:
scripts/documentation-file-ref-check --fix
Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org>
Acked-by: Andrew Jeffery <andrew@aj.id.au>
Reviewed-by: Dan Murphy <dmurphy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Drop the reg property since this only necessary for the parent and
add the missing thermal-sensor-cells property description.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Fixes: 37e9cc08e9678 ("dt-bindings: Add Broadcom AVS RO thermal")
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1579200077-17496-1-git-send-email-stefan.wahren@i2se.com
BCM7216 is a 16nm process STB chip, which requires a different
compatible string to differentiate different temperature formulas.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-4-f.fainelli@gmail.com
Since the BCM2711 doesn't have a AVS TMON block, the thermal information
must be retrieved from the AVS ring oscillator block. This block is part
of the AVS monitor which contains a bunch of raw sensors.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-2-git-send-email-stefan.wahren@i2se.com
sun8i-thermal driver supports thermal sensor in wide range of Allwinner
SoCs. Add YAML schema for its bindings.
Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-3-anarsoul@gmail.com
Pull thermal management updates from Zhang Rui:
- Fix a deadlock regression in thermal core framework, which was
introduced in 5.3 (Wei Wang)
- Initialize thermal control framework earlier to enable thermal
mitigation during boot (Amit Kucheria)
- Convert the Intelligent Power Allocator (IPA) thermal governor to
follow the generic PM_EM instead of its own Energy Model (Quentin
Perret)
- Introduce a new Amlogic soc thermal driver (Guillaume La Roque)
- Add interrupt support for tsens thermal driver (Amit Kucheria)
- Add support for MSM8956/8976 in tsens thermal driver
(AngeloGioacchino Del Regno)
- Add support for r8a774b1 in rcar thermal driver (Biju Das)
- Add support for Thermal Monitor Unit v2 in qoriq thermal driver
(Yuantian Tang)
- Some other fixes/cleanups on thermal core framework and soc thermal
drivers (Colin Ian King, Daniel Lezcano, Hsin-Yi Wang, Tian Tao)
* 'thermal/next' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (32 commits)
thermal: Fix deadlock in thermal thermal_zone_device_check
thermal: cpu_cooling: Migrate to using the EM framework
thermal: cpu_cooling: Make the power-related code depend on IPA
PM / EM: Declare EM data types unconditionally
arm64: defconfig: Enable CONFIG_ENERGY_MODEL
drivers: thermal: tsens: fix potential integer overflow on multiply
thermal: cpu_cooling: Reorder the header file
thermal: cpu_cooling: Remove pointless dependency on CONFIG_OF
thermal: no need to set .owner when using module_platform_driver
thermal: qcom: tsens-v1: Fix kfree of a non-pointer value
cpufreq: qcom-hw: Move driver initialization earlier
clk: qcom: Initialize clock drivers earlier
cpufreq: Initialize cpufreq-dt driver earlier
cpufreq: Initialize the governors in core_initcall
thermal: Initialize thermal subsystem earlier
thermal: Remove netlink support
dt: thermal: tsens: Document compatible for MSM8976/56
thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976
MAINTAINERS: add entry for Amlogic Thermal driver
thermal: amlogic: Add thermal driver to support G12 SoCs
...
Support for MSM8976 and MSM8956 (having tsens ip version 1) has
been added to the qcom tsens driver: document the addition here.
Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191005104133.30297-3-kholk11@gmail.com
Adding the devicetree binding documentation for the Amlogic temperature
sensor found in the Amlogic Meson G12A and G12B SoCs.
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-2-glaroque@baylibre.com
Older IP only supports the 'uplow' interrupt, but newer IP supports
'uplow' and 'critical' interrupts. Document interrupt support in the
tsens driver by converting over to a YAML schema.
Suggested-by: Stephen Boyd <swboyd@chromium.org>
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/d519be4c7198f47c3661f7326d1a724b97dc4973.1572526427.git.amit.kucheria@linaro.org
Convert the STM32 thermal binding to DT schema format using json-schema
Signed-off-by: Benjamin Gaignard <benjamin.gaignard@st.com>
Signed-off-by: Rob Herring <robh@kernel.org>
Some platforms like i.MX8M series SoCs have clock control for TMU,
add optional clocks property to the binding doc.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add a new compatible for thermal founding on PX30 SoCs.
Signed-off-by: Elaine Zhang <zhangqing@rock-chips.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
qcs404 uses v1 of the TSENS IP block. Create a fallback DT property
"qcom,tsens-v1" to gather common code
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add OC HW throttle configuration for soctherm in DT.
It is used to describe the OCx throttle events.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Fabio Estevam