Add optional property "nvidia,thermtrips".
If present, these trips will be used as HW shutdown trips,
and critical trips will be used as SW shutdown trips.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch adds binding document for mt8183 thermal controller.
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal controller implementation on Tegra194 is very similar to the
implementation on Tegra186. Add a compatible string for the new
generation.
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
RZ/G2M also has 3 interrupts routed to the TSC, but the list was not
updated to reflect this.
Just drop the list, as this is the case for this TSC variant in all
R-Car Gen3 and RZ/G2 SoCs.
Fixes: be6af481f3 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a774a1 support")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Pull thermal SoC updates from Eduardo Valentin:
"Several new things coming up. Specifics:
- Rework of tsens and hisi thermal drivers
- OF-thermal now allows sharing multiple cooling devices on maps
- Added support for r8a7744 and R8A77970 on rcar thermal driver
- Added support for r8a774a1 on rcar_gen3 thermal driver
- New thermal driver stm32
- Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada,
qcom-spmi, rcar, da9062/61"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits)
thermal: da9062/61: Prevent hardware access during system suspend
thermal: rcar_thermal: Prevent doing work after unbind
thermal: rcar_thermal: Prevent hardware access during system suspend
thermal: rcar_gen3_thermal: add R8A77980 support
dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings
thermal: add stm32 thermal driver
dt-bindings: stm32-thermal: add binding documentation
thermal: rcar_thermal: add R8A77970 support
dt-bindings: thermal: rcar-thermal: document R8A77970 bindings
thermal: rcar_thermal: fix duplicate IRQ request
dt-bindings: thermal: rcar: Add device tree support for r8a7744
thermal/drivers/hisi: Add the dual clusters sensors for hi3660
thermal/drivers/hisi: Add more sensors channel
thermal/drivers/hisi: Remove pointless irq field
thermal/drivers/hisi: Use platform_get_irq_byname
thermal/drivers/hisi: Replace macro name with relevant sensor location
thermal/drivers/hisi: Add multiple sensors support
thermal/drivers/hisi: Prepare to support multiple sensors
thermal/drivers/hisi: Factor out the probe functions
thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer
...
Document the R-Car V3M (R8A77970) SoC in the Renesas R-Car gen2 thermal
bindings. The hardware is the same as in the R-Car D3 (R8A77995) plus an
extra status register.
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add thermal sensor support for r8a7744 SoC. The Renesas RZ/G1N
(r8a7744) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The current example for a thermal zone isn't very useful as reference
since it would result in a hardware shutdown at 145°C, instead of
allowing the system to try to shutdown gracefully. Without an ADC
channel a maximum of two trip points is useful in practice for this
sensor, with temperatures corresponding to the stage 1 and stage 2
'hardware trip points'. A critical trip point at stage 2 may allow the
system to shutdown before a hardware shutdown at stage 3 kicks in. It
should be noted though that by default the chip performs a 'partial
shutdown' when the temperature reaches stage 2, which may prevent an
orderly shutdown. The 'partial shutdown' can be disabled by software.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The documentation claims that the 'reg' property consists of two values,
the SPMI address and the length of the controller's registers. However
the SPMI bus to which it is added specifies "#size-cells = <0>;". Remove
the controller register length from the documentation of the field and the
example.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Pull thermal management updates from Zhang Rui:
- Add Daniel Lezcano as the reviewer of thermal framework and SoC
driver changes (Daniel Lezcano).
- Fix a bug in intel_dts_soc_thermal driver, which does not translate
IO-APIC GSI (Global System Interrupt) into Linux irq number (Hans de
Goede).
- For device tree bindings, allow cooling devices sharing same trip
point with same contribution value to share cooling map (Viresh
Kumar).
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
dt-bindings: thermal: Allow multiple devices to share cooling map
MAINTAINERS: Add Daniel Lezcano as designated reviewer for thermal
Thermal: Intel SoC DTS: Translate IO-APIC GSI number to linux irq number
Pull thermal management updates from Eduardo Valentin:
- rework tsens driver to add support for tsens-v2 (Amit Kucheria)
- rework armada thermal driver to use syscon and multichannel support
(Miquel Raynal)
- fixes to TI SoC, IMX, Exynos, RCar, and hwmon drivers
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (34 commits)
thermal: armada: fix copy-paste error in armada_thermal_probe()
thermal: rcar_thermal: avoid NULL dereference in absence of IRQ resources
thermal: samsung: Remove Exynos5440 clock handling left-overs
thermal: tsens: Fix negative temperature reporting
thermal: tsens: switch from of_iomap() to devm_ioremap_resource()
thermal: tsens: Rename variable
thermal: tsens: Add generic support for TSENS v2 IP
thermal: tsens: Rename tsens-8996 to tsens-v2 for reuse
thermal: tsens: Add support to split up register address space into two
dt: thermal: tsens: Document the fallback DT property for v2 of TSENS IP
thermal: tsens: Get rid of unused fields in structure
thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info
thermal_hwmon: Sanitize attribute name passed to hwmon
dt-bindings: thermal: armada: add reference to new bindings
dt-bindings: cp110: add the thermal node in the syscon file
dt-bindings: cp110: update documentation since DT de-duplication
dt-bindings: ap806: add the thermal node in the syscon file
dt-bindings: cp110: prepare the syscon file to list other syscons nodes
dt-bindings: ap806: prepare the syscon file to list other syscons nodes
dt-bindings: cp110: rename cp110 syscon file
...
Allow cooling devices sharing same trip point with same contribution
value to share the cooling map as well. Otherwise the same information
will be duplicated for each device sharing the trip point.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
We want to create common code for v2 of the TSENS IP block that is used in
a large number of Qualcomm SoCs. "qcom,tsens-v2" should be able to handle
most of the common functionality start with a common get_temp() function.
It is also necessary to split out the memory regions for the TM and SROT
register banks because their offsets are not constant across SoC families.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Tested-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
New bindings (using a syscon) are available for AP806 and CP110
compatibles. Add a reference to these files from the original
documentation.
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
'interrupt-parent' is often documented as part of define bindings, but
it is really outside the scope of a device binding. It's never required
in a given node as it is often inherited from a parent node. Or it can
be implicit if a parent node is an 'interrupt-controller' node. So
remove it from all the binding files.
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Pull thermal SoC updates from Zhang Rui:
"Thermal SoC management updates:
- imx thermal driver now supports i.MX7 thermal sensor (Anson Huang)
- exynos thermal driver dropped support for exynos 5440 (Krzysztof
Kozlowski)
- rcar_thermal now supports r8a77995 (Yoshihiro Kaneko)
- rcar_gen3_thermal now supports r8a77965 (Niklas Söderlund)
- qcom-spmi-temp-alarm now supports GEN2 PMIC peripherals (David
Collins)
- uniphier thermal now supports UniPhier PXs3 (Kunihiko Hayashi)
- mediatek thermal now supports MT7622 SoC (Sean Wang)
- considerable refactoring of exynos driver (Bartlomiej
Zolnierkiewicz)
- small fixes all over the place on different drivers"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (50 commits)
thermal: qcom: tsens: Allow number of sensors to come from DT
thermal: tegra: soctherm: add const to struct thermal_cooling_device_ops
thermal: exynos: Reduce severity of too early temperature read
thermal: imx: Switch to SPDX identifier
thermal: qcom-spmi-temp-alarm: add support for GEN2 PMIC peripherals
thermal: ti-soc-thermal: fix incorrect entry in omap5430_adc_to_temp[]
thermal: rcar_thermal: add r8a77995 support
dt-bindings: thermal: rcar-thermal: add R8A77995 support
thermal: mediatek: use of_device_get_match_data()
thermal: exynos: remove trip reporting to user-space
thermal: exynos: remove unused defines for Exynos5433
thermal: exynos: cleanup code for enabling threshold interrupts
thermal: exynos: check return values of ->get_trip_[temp, hyst] methods
thermal: exynos: move trips setting to exynos_tmu_initialize()
thermal: exynos: set trips in ascending order in exynos7_tmu_initialize()
thermal: exynos: do not use trips structure directly in ->tmu_initialize
thermal: exynos: add exynos*_tmu_set_[trip,hyst]() helpers
thermal: exynos: move IRQs clearing to exynos_tmu_initialize()
thermal: exynos: clear IRQs later in exynos4412_tmu_initialize()
thermal: exynos: make ->tmu_initialize method void
...
- Sync dtc with upstream version v1.4.6-21-g84e414b0b5bc. This adds new
warnings which are either fixed or disabled by default (enabled with
W=1).
- Validate an untrusted offset in DT overlay function
update_usages_of_a_phandle_reference
- Fix a use after free error of_platform_device_destroy
- Fix an off by 1 string errors in unittest
- Avoid creating a struct device for OPP nodes
- Update DT specific submitting-patches.txt with patch content and
subject requirements.
- Move some bindings to their proper subsystem locations
- Add vendor prefixes for Kaohsiung, SiFive, Avnet, Wi2Wi, Logic PD, and
ArcherMind
- Add documentation for "no-gpio-delays" property in FSI bus GPIO master
- Add compatible for r8a77990 SoC ravb ethernet block
- More wack-a-mole removal of 'status' property in examples
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Merge tag 'devicetree-for-4.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull DeviceTree updates from Rob Herring:
- Sync dtc with upstream version v1.4.6-21-g84e414b0b5bc. This adds new
warnings which are either fixed or disabled by default (enabled with
W=1).
- Validate an untrusted offset in DT overlay function
update_usages_of_a_phandle_reference
- Fix a use after free error of_platform_device_destroy
- Fix an off by 1 string errors in unittest
- Avoid creating a struct device for OPP nodes
- Update DT specific submitting-patches.txt with patch content and
subject requirements.
- Move some bindings to their proper subsystem locations
- Add vendor prefixes for Kaohsiung, SiFive, Avnet, Wi2Wi, Logic PD,
and ArcherMind
- Add documentation for "no-gpio-delays" property in FSI bus GPIO
master
- Add compatible for r8a77990 SoC ravb ethernet block
- More wack-a-mole removal of 'status' property in examples
* tag 'devicetree-for-4.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (25 commits)
dt-bindings: submitting-patches: add guidance on patch content and subject
of: platform: stop accessing invalid dev in of_platform_device_destroy
dt-bindings: net: ravb: Add support for r8a77990 SoC
dt-bindings: Add vendor prefix for ArcherMind
dt-bindings: fsi-master-gpio: Document "no-gpio-delays" property
dt-bindings: Add vendor prefix for Logic PD
of: overlay: validate offset from property fixups
of: unittest: for strings, account for trailing \0 in property length field
drm: rcar-du: disable dtc graph-endpoint warnings on DT overlays
kbuild: disable new dtc graph and unit-address warnings
scripts/dtc: Update to upstream version v1.4.6-21-g84e414b0b5bc
MAINTAINERS: add keyword for devicetree overlay notifiers
dt-bindings: define vendor prefix for Wi2Wi, Inc.
dt-bindings: Add vendor prefix for Avnet, Inc.
dt-bindings: Relocate Tegra20 memory controller bindings
dt-bindings: Add "sifive" vendor prefix
dt-bindings: exynos: move ADC binding to iio/adc/ directory
dt-bindings: powerpc/4xx: move 4xx NDFC and EMAC bindings to subsystem directories
dt-bindings: move various RNG bindings to rng/ directory
dt-bindings: move various timer bindings to timer/ directory
...
For platforms that has multiple copies of the TSENS hardware block it's
necessary to be able to specify the number of sensors per block in DeviceTree.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The Exynos5440 is not actively developed, there are no development
boards available and probably there are no real products with it.
Remove wide-tree support for Exynos5440.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
[b.zolnierkie: ported over driver changes]
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Based on previous work by Ryo Kataoka <ryo.kataoka.wt@renesas.com>.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch adds i.MX7 thermal sensor support, most
of the i.MX7 thermal sensor functions are same with
i.MX6 except the registers offset/layout, so we move
those registers offset/layout definitions to soc data
structure.
i.MX7 uses single calibration data @25C, the calibration
data is located at OCOTP offset 0x4F0, bit[17:9], the
formula is as below:
Tmeas = (Nmeas - n1) + 25; n1 is the fuse value for 25C.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Bai Ping <ping.bai@nxp.com>
Acked-by: Dong Aisheng <aisheng.dong@nxp.com>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add devicetree bindings for MediaTek MT7622 thermal controller
Changes v1 -> v2: add tag from Rob
Signed-off-by: Sean Wang <sean.wang@mediatek.com>
Signed-off-by: Shunli Wang <shunli.wang@mediatek.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The datasheet has been expanded with more registers and the DT files
have been updated with the new size. This change updates the example so
writing new DT files can use the enhanced driver which uses the new
registers.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
[robh: s/have/has/, s/enchanted/enhanced/]
Signed-off-by: Rob Herring <robh@kernel.org>
The "cooling-min-level" and "cooling-max-level" properties are not
parsed by any part of kernel currently and the max cooling state of a
CPU cooling device is found by referring to the cpufreq table instead.
Remove the unused bindings.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Due to the old method has already been marked as deprecated in binding
doc, so obviously it's better to update the example to new bindings
as well.
Cc: Shawn Guo <shawn.guo@linaro.org>
Cc: Leonard Crestez <leonard.crestez@nxp.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Dong Aisheng <aisheng.dong@nxp.com>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Pull thermal management updates from Zhang Rui:
- fix a race condition issue in power allocator governor (Yi Zeng).
- add support for AP806 and CP110 in armada thermal driver, together
with several improvements (Baruch Siach, Miquel Raynal)
- add support for r8z7743 in rcar thermal driver (Biju Das)
- convert thermal core to use new hwmon API to avoid warning (Fabio
Estevam)
- small fixes and cleanups in thermal core and x86_pkg_thermal,
int3400_thermal, hisi_thermal, mtk_thermal and imx_thermal drivers
(Pravin Shedge, Geert Uytterhoeven, Alexey Khoroshilov, Brian Bian,
Matthias Brugger, Nicolin Chen, Uwe Kleine-König)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
thermal: thermal_hwmon: Convert to hwmon_device_register_with_info()
thermal/x86 pkg temp: Remove debugfs_create_u32() casts
thermal: int3400_thermal: fix error handling in int3400_thermal_probe()
thermal/drivers/hisi: Remove bogus const from function return type
thermal: armada: Give meaningful names to the thermal zones
thermal: armada: Wait sensors validity before exiting the init callback
thermal: armada: Change sensors trim default value
thermal: armada: Update Kconfig and module description
thermal: armada: Add support for Armada CP110
thermal: armada: Add support for Armada AP806
thermal: armada: Use real status register name
thermal: armada: Clarify control registers accesses
thermal: armada: Simplify the check of the validity bit
thermal: armada: Use msleep for long delays
dt-bindings: thermal: Describe Armada AP806 and CP110
dt-bindings: thermal: rcar: Add device tree support for r8a7743
thermal: mtk: Cleanup unused defines
thermal: imx: update to new formula according to NXP AN5215
thermal: imx: use consistent style to write temperatures
thermal: imx: improve comments describing algorithm for temp calculation
...
Add compatible strings for AP806 and CP110 that are part of the Armada
8k/7k line of SoCs.
Add a note on the differences in the size of the control area in
different bindings. This is an existing difference between the Armada
375 binding and the other boards already supported. The new AP806 and
CP110 bindings are similar to the existing Armada 375 in this regard.
Signed-off-by: Baruch Siach <baruch@tkos.co.il>
[<miquel.raynal@free-electrons.com>: reword, additional details]
Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add thermal sensor support for r8a7743 SoC. The Renesas RZ/G1M
(r8a7743) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Simon Horman <simon.horman@netronome.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
DT unit addresses should be lower case hex. Fix all the
binding examples.
Converted with the following command from Krzysztof Kozlowski:
sed -e 's/@\([a-fA-F0-9_-]*\) {/@\L\1 {/' -i $(find Documentation/devicetree/bindings -name '*.txt')
Signed-off-by: Rob Herring <robh@kernel.org>
Improve the binding example by removing all the leading 0x to fix the
following dtc warnings:
Warning (unit_address_format): Node /XXX unit name should not have leading "0x"
Converted using the following command:
find Documentation/devicetree/bindings -name "*.txt" -exec sed -i -e 's/([^ ])\@0x([0-9a-f])/$1\@$2/g' {} +
This is a follow up to commit 48c926cd34
Signed-off-by: Mathieu Malaterre <malat@debian.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Pull thermal management updates from Zhang Rui:
- introduce brcmstb AVS TMON thermal driver (Brian Norris)
- add Rockchip RV1108 support in rockchip thermal driver (Rocky Hao)
- major rework on HISI driver plus additional support of hisi3660
(Daniel Lezcano)
- add nvmem-cells binding on imx6sx (Leonard Crestez)
- fix a NULL pointer dereference on ti thermal driver unloading (Tony
Lindgren)
- improve tmon tool to make it easier to cross-compile tmon (Markus
Mayer)
- add Coffee Lake and Cannon Lake support for intel processor and pch
thermal drivers (Srinivas Pandruvada)
- other small fixes and cleanups (Arvind Yadav, Colin Ian King, Allen
Wild, Nicolin Chen, Baruch SiachNiklas Söderlund, Arnd Bergmann)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (44 commits)
thermal: pch: Add Cannon Lake support
thermal: int340x: processor_thermal: Add Coffee Lake support
thermal: int340x: processor_thermal: Add Cannon Lake support
thermal: bxt: remove redundant variable trip
thermal: cpu_cooling: pr_err() strings should end with newlines
thermal: add brcmstb AVS TMON driver
Documentation: devicetree: add binding for Broadcom STB AVS TMON
thermal/drivers/hisi: Add support for hi3660 SoC
thermal/drivers/hisi: Prepare to add support for other hisi platforms
thermal/drivers/hisi: Add platform prefix to function name
thermal/drivers/hisi: Put platform code together
thermal/drivers/qcom-spmi: Use devm_iio_channel_get
thermal/drivers/generic-iio-adc: Switch tz request to devm version
thermal/drivers/step_wise: Fix temperature regulation misbehavior
thermal/drivers/hisi: Use round up step value
thermal/drivers/hisi: Move the clk setup in the corresponding functions
thermal/drivers/hisi: Remove mutex_lock in the code
thermal/drivers/hisi: Remove thermal data back pointer
thermal/drivers/hisi: Convert long to int
thermal/drivers/hisi: Rename and remove unused field
...
Add a new compatible for thermal founding on RV1108 SoCs.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This contains the addition of a clock alias which will be used to fix
the implementation of the SOR1 clock.
Also included are the bindings for the Tegra186 BPMP thermal driver, a
prerequisite for both the driver and device tree changes.
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Merge tag 'tegra-for-4.15-dt-bindings' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux into next/dt
Pull "dt-bindings: Updates for v4.15-rc1" from Thierry Reding:
This contains the addition of a clock alias which will be used to fix
the implementation of the SOR1 clock.
Also included are the bindings for the Tegra186 BPMP thermal driver, a
prerequisite for both the driver and device tree changes.
* tag 'tegra-for-4.15-dt-bindings' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux:
dt-bindings: Add bindings for nvidia,tegra186-bpmp-thermal
dt-bindings: clock: tegra: Add sor1_out clock
In Tegra186, the BPMP (Boot and Power Management Processor) implements
an interface that is used to read system temperatures, including CPU
cluster and GPU temperatures. This binding describes the thermal sensor
that is exposed by BPMP.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.
Signed-off-by: Kevin Wangtao <kevin.wangtao@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
On newer imx SOCs accessing OCOTP directly is wrong because the ocotp
clock needs to be enabled first. Add a binding for accessing the same
values through the imx-ocotp nvmem driver using nvmem-cells. This is
similar to other thermal drivers.
The old binding is preserved for compatibility and because it still
works fine on imx6qdl series chips.
In theory this problem could be solved by adding a reference to the
OCOTP clock instead but it is better to hide such details in a specific
nvmem driver.
Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal updates from Zhang Rui:
- fix resources release in error paths when registering thermal zone.
(Christophe Jaillet)
- introduce a new thermal driver for on-chip PVT (Process, Voltage and
Temperature) monitoring unit implemented on UniPhier SoCs. This
driver supports temperature monitoring and alert function. (Kunihiko
Hayashi)
- Add support for mt2712 chip in the mtk_thermal driver. (Louis Yu)
- Add support for RK3328 SOC in rockchip_thermal driver. (Rocky Hao)
- cleanup a couple of platform thermal drivers to constify
thermal_zone_of_device_ops structures. (Julia Lawall)
- a couple of fixes in int340x and intel_pch_thermal thermal driver.
(Arvind Yadav, Sumeet Pawnikar, Brian Bian, Ed Swierk, Zhang Rui)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (27 commits)
Thermal: int3406_thermal: fix thermal sysfs I/F
thermal: mediatek: minor mtk_thermal.c cleanups
thermal: mediatek: extend calibration data for mt2712 chip
thermal: mediatek: add Mediatek thermal driver for mt2712
dt-bindings: thermal: Add binding document for Mediatek thermal controller
thermal: intel_pch_thermal: Fix enable check on Broadwell-DE
thermal: rockchip: Support the RK3328 SOC in thermal driver
dt-bindings: rockchip-thermal: Support the RK3328 SoC compatible
thermal: bcm2835: constify thermal_zone_of_device_ops structures
thermal: exynos: constify thermal_zone_of_device_ops structures
thermal: zx2967: constify thermal_zone_of_device_ops structures
thermal: rcar_gen3_thermal: constify thermal_zone_of_device_ops structures
thermal: qoriq: constify thermal_zone_of_device_ops structures
thermal: hisilicon: constify thermal_zone_of_device_ops structures
thermal: core: Fix resources release in error paths in thermal_zone_device_register()
thermal: core: Use the new 'thermal_zone_destroy_device_groups()' helper function
thermal: core: Add some new helper functions to free resources
thermal: int3400_thermal: process "thermal table changed" event
thermal: uniphier: add UniPhier thermal driver
dt-bindings: thermal: add binding documentation for UniPhier thermal monitor
...
Pretty much any node can have a status property, so it doesn't need to
be in examples.
Converted with the following command and removed examples with SoC and
board specific splits:
git grep -l -E 'status.*=.*' Documentation/devicetree/ | xargs sed -i -E '/\sstatus.*=.*"(disabled|ok|okay)/d'
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Rob Herring <robh@kernel.org>
This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2712.
Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
attempt to new compatible for thermal founding on RK3328 SoC.
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add the missing .txt extension to the Broadcom Northstar binding document.
Signed-off-by: Markus Mayer <mmayer@broadcom.com>
Signed-off-by: Rob Herring <robh@kernel.org>
Device tree binding information for DA9062 and DA9061 thermal junction
temperature monitor.
Binding descriptions for the DA9061 and DA9062 thermal TJUNC supervisor
device driver, using a single THERMAL_TRIP_HOT trip-wire and allowing for
a configurable polling period for over-temperature polling.
This patch also adds two examples, one for DA9062 and one for DA9061. The
DA9061 example uses a fall-back compatible string for the DA9062.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This commit documents binding for thermal used in Northstar family SoCs.
There isn't any known Northstar device with active cooling system so DT
example has empty cooling-maps node. There is also no support for CPU
frequency throttling so I put only a critical trip in the example.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a thermal zone in order to make the example complete.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
For different types of SoC the sensor id and endianness may vary.
"#thermal-sensor-cells" is used to provide sensor id information.
"little-endian" property is to tell the endianness of TMU.
Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Scott Wood <scottwood@freescale.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Lots of changes as usual, so I'm trying to be brief here. Most of the
new hardware support has the respective driver changes merged through
other trees or has had it available for a while, so this is where things
come together.
We get a DT descriptions for a couple of new SoCs, all of them variants
of other chips we already support, and usually coming with a new
evaluation board:
- Oxford semiconductor (now Broadcom) OX820 SoC for NAS devices
- Qualcomm MDM9615 LTE baseband
- NXP imx6ull, the latest and smallest i.MX6 application processor variant
- Renesas RZ/G (r8a7743 and r8a7745) application processors
- Rockchip PX3, a variant of the rk3188 chip used in Android tablets
- Rockchip rk1108 single-core application processor
- ST stm32f746 Cortex-M7 based microcontroller
- TI DRA71x automotive processors
These are commercially available consumer platforms we now support:
- Motorola Droid 4 (xt894) mobile phone
- Rikomagic MK808 Android TV stick based on Rockchips rx3066
- Cloud Engines PogoPlug v3 based on OX820
- Various Broadcom based wireless devices:
- Netgear R8500 router
- Tenda AC9 router
- TP-LINK Archer C9 V1
- Luxul XAP-1510 Access point
- Turris Omnia open hardware router based on Armada 385
And a couple of new boards targeted at developers, makers
or industrial integration:
- Macnica Sodia development platform for Altera socfpga (Cyclone V)
- MicroZed board based on Xilinx Zynq FPGA platforms
- TOPEET itop/elite based on exynos4412
- WP8548 MangOH Open Hardware platform for IOT, based on
Qualcomm MDM9615
- NextThing CHIP Pro gadget
- NanoPi M1 development board
- AM571x-IDK industrial board based on TI AM5718
- i.MX6SX UDOO Neo
- Boundary Devices Nitrogen6_SOM2 (i.MX6)
- Engicam i.CoreM6
- Grinn i.MX6UL liteSOM/liteBoard
- Toradex Colibri iMX6 module
Other changes:
- added peripherals on renesas, davinci, stm32f429, uniphier, sti,
mediatek, integrator, at91, imx, vybrid, ls1021a, omap, qualcomm,
mvebu, allwinner, broadcom, exynos, zynq
- Continued fixes for W=1 dtc warnings
- The old STiH415/416 SoC support gets removed, these never made it into
products and have served their purpose in the kernel as a template
for teh newer chips from ST
- The exynos4415 dtsi file is removed as nothing uses it.
- Intel PXA25x can now be booted using devicetree
Conflicts:
arch/arm/boot/dts/r8a*.dtsi: a node was added
the clk tree, keep both sides and watch out for git
dropping the required '};' at the end of each side.
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Merge tag 'armsoc-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc
Pull ARM DT updates from Arnd Bergmann:
"Lots of changes as usual, so I'm trying to be brief here. Most of the
new hardware support has the respective driver changes merged through
other trees or has had it available for a while, so this is where
things come together.
We get a DT descriptions for a couple of new SoCs, all of them
variants of other chips we already support, and usually coming with a
new evaluation board:
- Oxford semiconductor (now Broadcom) OX820 SoC for NAS devices
- Qualcomm MDM9615 LTE baseband
- NXP imx6ull, the latest and smallest i.MX6 application processor variant
- Renesas RZ/G (r8a7743 and r8a7745) application processors
- Rockchip PX3, a variant of the rk3188 chip used in Android tablets
- Rockchip rk1108 single-core application processor
- ST stm32f746 Cortex-M7 based microcontroller
- TI DRA71x automotive processors
These are commercially available consumer platforms we now support:
- Motorola Droid 4 (xt894) mobile phone
- Rikomagic MK808 Android TV stick based on Rockchips rx3066
- Cloud Engines PogoPlug v3 based on OX820
- Various Broadcom based wireless devices:
- Netgear R8500 router
- Tenda AC9 router
- TP-LINK Archer C9 V1
- Luxul XAP-1510 Access point
- Turris Omnia open hardware router based on Armada 385
And a couple of new boards targeted at developers, makers or
industrial integration:
- Macnica Sodia development platform for Altera socfpga (Cyclone V)
- MicroZed board based on Xilinx Zynq FPGA platforms
- TOPEET itop/elite based on exynos4412
- WP8548 MangOH Open Hardware platform for IOT, based on Qualcomm MDM9615
- NextThing CHIP Pro gadget
- NanoPi M1 development board
- AM571x-IDK industrial board based on TI AM5718
- i.MX6SX UDOO Neo
- Boundary Devices Nitrogen6_SOM2 (i.MX6)
- Engicam i.CoreM6
- Grinn i.MX6UL liteSOM/liteBoard
- Toradex Colibri iMX6 module
Other changes:
- added peripherals on renesas, davinci, stm32f429, uniphier, sti,
mediatek, integrator, at91, imx, vybrid, ls1021a, omap, qualcomm,
mvebu, allwinner, broadcom, exynos, zynq
- Continued fixes for W=1 dtc warnings
- The old STiH415/416 SoC support gets removed, these never made it
into products and have served their purpose in the kernel as a
template for teh newer chips from ST
- The exynos4415 dtsi file is removed as nothing uses it.
- Intel PXA25x can now be booted using devicetree"
* tag 'armsoc-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (422 commits)
arm: dts: zynq: Add MicroZed board support
ARM: dts: da850: enable high speed for mmc
ARM: dts: da850: Add node for pullup/pulldown pinconf
ARM: dts: da850: enable memctrl and mstpri nodes per board
ARM: dts: da850-lcdk: Add ethernet0 alias to DT
ARM: dts: artpec: add pcie support
ARM: dts: add support for Turris Omnia
devicetree: Add vendor prefix for CZ.NIC
ARM: dts: berlin2q-marvell-dmp: fix typo in chosen node
ARM: dts: berlin2q-marvell-dmp: fix regulators' name
ARM: dts: Add xo to sdhc clock node on qcom platforms
ARM: dts: r8a7794: Add device node for PRR
ARM: dts: r8a7793: Add device node for PRR
ARM: dts: r8a7792: Add device node for PRR
ARM: dts: r8a7791: Add device node for PRR
ARM: dts: r8a7790: Add device node for PRR
ARM: dts: r8a7779: Add device node for PRR
ARM: dts: r8a73a4: Add device node for PRR
ARM: dts: sk-rzg1e: add Ether support
ARM: dts: sk-rzg1e: initial device tree
...
please pull the following:
- Rafal adds support for the Netgear R8500 routers, adds basic support
for the Tenda AC9 router which uses the new BCM53573 SoC (single core Cortex
A7). He also enables the UART on the Netgear R8000 and restructures the
include files a bit for the BCM47094 SoC, finally he adds USB 3.0 PHY nodes
which enables USB 3.0 on BCM5301X devices that support it. Finally he adds
support for the TP-LINK Archer C9 V1 router.
- Kamal adds support for the QSPI controller on the Northstar Plus SoCs and updates
the bcm958625k reference board to have it enabled
- Dan adds support for the Luxul XAP-1510 (using a BCM4708) and XWR-3100 (using
a BCM47094)
- Scott fixes the pinctrl names in the Cygnus DTS files
- Jonathan enables the Broadcom iProc mailbox controller for Broadcom Cygnus/iProc
SoCs, he adds interrupt support for the GPIO CRMU hardware block and finally adds
the node for the OTP controller found on Cygnus SoCs
- Dhananjay enables the GPIO B controller on Norstarh Plus SoCs
- Eric defines standard pinctrl groups in the BCM2835 GPIO node
- Gerd adds definitions for the pinctrl groups and updates the PWM, I2C and SDHCI nodes
to use their appropriate pinctrl functions
- Linus adds names for the Raspberry Pi GPIO lines based on the datasheet
- Martin adds the DT binding and nodes for the Raspberry Pi firmware thermal block
- Stefan fixes a few typos with respect to the BCM2835 mailbox binding example and
Device Tree nodes he also fixes the Raspberry Pi GPIO lines names and finally
adds names for the Raspberry Zero GPIO lines
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Merge tag 'arm-soc/for-4.10/devicetree' of http://github.com/Broadcom/stblinux into next/dt
Pull "Broadcom devicetree changes for 4.10" from Florian Fainelli:
This pull request contains Broadcom ARM-based SoC Device Tree changes for 4.10,
please pull the following:
- Rafal adds support for the Netgear R8500 routers, adds basic support
for the Tenda AC9 router which uses the new BCM53573 SoC (single core Cortex
A7). He also enables the UART on the Netgear R8000 and restructures the
include files a bit for the BCM47094 SoC, finally he adds USB 3.0 PHY nodes
which enables USB 3.0 on BCM5301X devices that support it. Finally he adds
support for the TP-LINK Archer C9 V1 router.
- Kamal adds support for the QSPI controller on the Northstar Plus SoCs and updates
the bcm958625k reference board to have it enabled
- Dan adds support for the Luxul XAP-1510 (using a BCM4708) and XWR-3100 (using
a BCM47094)
- Scott fixes the pinctrl names in the Cygnus DTS files
- Jonathan enables the Broadcom iProc mailbox controller for Broadcom Cygnus/iProc
SoCs, he adds interrupt support for the GPIO CRMU hardware block and finally adds
the node for the OTP controller found on Cygnus SoCs
- Dhananjay enables the GPIO B controller on Norstarh Plus SoCs
- Eric defines standard pinctrl groups in the BCM2835 GPIO node
- Gerd adds definitions for the pinctrl groups and updates the PWM, I2C and SDHCI nodes
to use their appropriate pinctrl functions
- Linus adds names for the Raspberry Pi GPIO lines based on the datasheet
- Martin adds the DT binding and nodes for the Raspberry Pi firmware thermal block
- Stefan fixes a few typos with respect to the BCM2835 mailbox binding example and
Device Tree nodes he also fixes the Raspberry Pi GPIO lines names and finally
adds names for the Raspberry Zero GPIO lines
* tag 'arm-soc/for-4.10/devicetree' of http://github.com/Broadcom/stblinux: (29 commits)
ARM: bcm2835: Add names for the RPi Zero GPIO lines
ARM: bcm2835: Fix names for the Raspberry Pi GPIO lines
ARM: dts: enable GPIO-b for Broadcom NSP
ARM: BCM5301X: Add DT for TP-LINK Archer C9 V1
ARM: dts: Add node for Broadcom OTP controller driver
ARM: dts: Enable interrupt support for cygnus crmu gpio driver
ARM: dts: Enable Broadcom iProc mailbox controller
ARM: bcm2835: Add names for the Raspberry Pi GPIO lines
ARM: bcm2835: dts: add thermal node to device-tree of bcm283x
dt: bindings: add thermal device driver for bcm2835
ARM: dts: bcm283x: fix typo in mailbox address
DT: binding: bcm2835-mbox: fix address typo in example
ARM: dts: cygnus: fix naming of pinctrl node
ARM: BCM53573: Specify PMU and its ILP clock in the DT
ARM: BCM5301X: Add DT for Luxul XWR-3100
ARM: BCM5301X: Add DT for Luxul XAP-1510
ARM: BCM5301X: Specify USB 3.0 PHY in DT
ARM: BCM5301X: Enable UART on Netgear R8000
ARM: BCM5301X: Add separated DTS include file for BCM47094
ARM: dts: NSP: Add QSPI nodes to NSPI and bcm958625k DTSes
...
"rockchip,hw-tshut-temp", "rockchip,hw-tshut-mode" and
"rockchip,hw-tshut-polarity" are not a required properties
actually as the code could also work by loading the default
settings there. So it is apprently misleading, although we
prefer to get these from DT. And it seems we miss the 'rockchip,grf'
here which should also be an optional property.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Shawn Lin <shawn.lin@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
STiH415/6 SoC's are being removed from the kernel. This
patch removes the compatibles from the dt doc and also
updates the example to a supported platform.
Signed-off-by: Peter Griffin <peter.griffin@linaro.org>
Cc: <rui.zhang@intel.com>
Cc: <edubezval@gmail.com>
Cc: <robh+dt@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Add HW throttle configuration sub-node for soctherm, which
is used to describe the throttle event, and worked as a
cooling device. The "hot" type trip in thermal zone can
be bound to this cooling device, and trigger the throttle
function.
Signed-off-by: Wei Ni <wni@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2701.
Signed-off-by: Dawei Chien <dawei.chien@mediatek.com>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Maxim Semiconductor MAX77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add DT binding document to details out the DT property related
to MAX77620 thermal functionality.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.
Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.
Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
See the thermal code, the obvious typo from my editor.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
- Introduce generic ADC thermal driver, based on OF thermal (Laxman
Dewangan)
- Introduce new thermal driver for Tango chips (Marc Gonzalez)
- Rockchip driver support for RK3399, RK3366, and some fixes (Caesar
Wang, Elaine Zhang and Shawn Lin)
- Add CPU power cooling model to Mediatek thermal driver (Dawei Chien)
- Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin)
- TI thermal driver gained a new maintainer (Keerthy).
- Enabled powerclamp driver by checking CPU feature and package cstate
counter instead of CPU whitelist (Jacob Pan)
- Various fixes on thermal governor, OF thermal, Tegra, and RCAR
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits)
thermal: tango: initialize TEMPSI_CFG
thermal: rockchip: use the usleep_range instead of udelay
thermal: rockchip: add the notes for better reading
thermal: rockchip: Support RK3366 SoCs in the thermal driver
thermal: rockchip: handle the power sequence for tsadc controller
thermal: rockchip: update the tsadc table for rk3399
thermal: rockchip: fixes the code_to_temp for tsadc driver
thermal: rockchip: disable thermal->clk in err case
thermal: tegra: add Tegra132 specific SOC_THERM driver
thermal: fix ptr_ret.cocci warnings
thermal: mediatek: Add cpu dynamic power cooling model.
thermal: generic-adc: Add ADC based thermal sensor driver
thermal: generic-adc: Add DT binding for ADC based thermal sensor
thermal: tegra: fix static checker warning
thermal: tegra: mark PM functions __maybe_unused
thermal: add temperature sensor support for tango SoC
thermal: hisilicon: fix IRQ imbalance enabling
thermal: hisilicon: support to use any sensor
thermal: rcar: Remove binding docs for r8a7794
thermal: tegra: add PM support
...
Sometimes, thermal sensors like NCT thermistors are connected to
the ADC channel. The temperature is read by reading the voltage
across the sensor resistance via ADC and referring the lookup
table for ADC value to temperature.
Add DT binding doc for the ADC based thermal sensor driver to
detail the DT property and provide the example for how to use it.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Acked-by: Rob Herring <rob@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.
This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.
Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The latest information that I have is that there is no thermal IP
block present on the r8a7794 SoC so remove the corresponding binding.
Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The "critical" type trip in thermal zone can be
set to SOC_THERM hardware, it can trigger shut down
or reset event from hardware.
Signed-off-by: Wei Ni <wni@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Device tree binding for NVIDIA Tegra have traditionally carried the
"nvidia," vendor prefix in the filename. A couple of odd ones don't, so
fix them up for consistency.
Also rename existing bindings to reflect the first compatible value that
they document. This wasn't done consistently either.
Acked-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rob Herring <robh@kernel.org>
When Tegra124 support was first merged the unit-addresses of all devices
were listed with a "0," prefix to encode the reg property's second cell.
It turns out that this notation is not correct, and the "," separator is
only used to separate fields in the unit address (such as the device and
function number in PCI devices), not individual cells for addresses
with more than one cell.
Acked-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rob Herring <robh@kernel.org>
The Exynos Thermal Management Unit binding says that the vtmu-supply
is optional but is listed in the required properties section. Add an
optional properties section and move the regulator property there.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Andi Shyti <andi.shyti@samsung.com>
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Document the number of configurable temperature thresholds (for
trip-points in interrupt-driven mode).
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Commit 488c7455d7 ("thermal: exynos: Add the support for Exynos5433
TMU") added new compatible but forgot to update documentation.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT8173 and other SoCs.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Reviewed-by: Daniel Kurtz <djkurtz@chromium.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch enables to use thermal-zone on DT if it was calles as
"renesas,rcar-thermal-gen2".
Previous style (= non thermal-zone) is still supported by
"renesas,rcar-thermal" to keep compatibility for "git bisect".
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Pull thermal management updates from Zhang Rui:
"The top merge commit was re-generated yesterday because two topic
branches were dropped from this pull request in the last minute due to
some unaddressed comments. All the other material has been in
linux-next for quite a while.
Specifics:
- Enhance thermal core to handle unexpected device cooling states
after fresh boot and system resume. From Zhang Rui and Chen Yu.
- Several fixes and cleanups on Rockchip and RCAR thermal drivers.
From Caesar Wang and Kuninori Morimoto.
- Add Broxton support for Intel processor thermal reporting device
driver. From Amy Wiles"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
thermal: trip_point_temp_store() calls thermal_zone_device_update()
thermal: rcar: rcar_thermal_get_temp() return error if strange temp
thermal: rcar: check irq possibility in rcar_thermal_irq_xxx()
thermal: rcar: check every rcar_thermal_update_temp() return value
thermal: rcar: move rcar_thermal_dt_ids to upside
thermal: rockchip: Support the RK3399 SoCs in thermal driver
thermal: rockchip: Support the RK3228 SoCs in thermal driver
dt-bindings: rockchip-thermal: Support the RK3228/RK3399 SoCs compatible
thermal: rockchip: fix a trivial typo
Thermal: Enable Broxton SoC thermal reporting device
thermal: constify pch_dev_ops structure
Thermal: do thermal zone update after a cooling device registered
Thermal: handle thermal zone device properly during system sleep
Thermal: initialize thermal zone device correctly
- Ground work for the new Power9 MMU from Aneesh Kumar K.V
- Optimise FP/VMX/VSX context switching from Anton Blanchard
- Various cleanups from Krzysztof Kozlowski, John Ogness, Rashmica Gupta,
Russell Currey, Gavin Shan, Daniel Axtens, Michael Neuling, Andrew Donnellan
- Allow wrapper to work on non-english system from Laurent Vivier
- Add rN aliases to the pt_regs_offset table from Rashmica Gupta
- Fix module autoload for rackmeter & axonram drivers from Luis de Bethencourt
- Include KVM guest test in all interrupt vectors from Paul Mackerras
- Fix DSCR inheritance over fork() from Anton Blanchard
- Make value-returning atomics & {cmp}xchg* & their atomic_ versions fully ordered from Boqun Feng
- Print MSR TM bits in oops messages from Michael Neuling
- Add TM signal return & invalid stack selftests from Michael Neuling
- Limit EPOW reset event warnings from Vipin K Parashar
- Remove the Cell QPACE code from Rashmica Gupta
- Append linux_banner to exception information in xmon from Rashmica Gupta
- Add selftest to check if VSRs are corrupted from Rashmica Gupta
- Remove broken GregorianDay() from Daniel Axtens
- Import Anton's context_switch2 benchmark into selftests from Michael Ellerman
- Add selftest script to test HMI functionality from Daniel Axtens
- Remove obsolete OPAL v2 support from Stewart Smith
- Make enter_rtas() private from Michael Ellerman
- PPR exception cleanups from Michael Ellerman
- Add page soft dirty tracking from Laurent Dufour
- Add support for Nvlink NPUs from Alistair Popple
- Add support for kexec on 476fpe from Alistair Popple
- Enable kernel CPU dlpar from sysfs from Nathan Fontenot
- Copy only required pieces of the mm_context_t to the paca from Michael Neuling
- Add a kmsg_dumper that flushes OPAL console output on panic from Russell Currey
- Implement save_stack_trace_regs() to enable kprobe stack tracing from Steven Rostedt
- Add HWCAP bits for Power9 from Michael Ellerman
- Fix _PAGE_PTE breaking swapoff from Aneesh Kumar K.V
- Fix _PAGE_SWP_SOFT_DIRTY breaking swapoff from Hugh Dickins
- scripts/recordmcount.pl: support data in text section on powerpc from Ulrich Weigand
- Handle R_PPC64_ENTRY relocations in modules from Ulrich Weigand
- cxl: Fix possible idr warning when contexts are released from Vaibhav Jain
- cxl: use correct operator when writing pcie config space values from Andrew Donnellan
- cxl: Fix DSI misses when the context owning task exits from Vaibhav Jain
- cxl: fix build for GCC 4.6.x from Brian Norris
- cxl: use -Werror only with CONFIG_PPC_WERROR from Brian Norris
- cxl: Enable PCI device ID for future IBM CXL adapter from Uma Krishnan
- Freescale updates from Scott: Highlights include moving QE code out of
arch/powerpc (to be shared with arm), device tree updates, and minor fixes.
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Merge tag 'powerpc-4.5-1' of git://git.kernel.org/pub/scm/linux/kernel/git/powerpc/linux
Pull powerpc updates from Michael Ellerman:
"Core:
- Ground work for the new Power9 MMU from Aneesh Kumar K.V
- Optimise FP/VMX/VSX context switching from Anton Blanchard
Misc:
- Various cleanups from Krzysztof Kozlowski, John Ogness, Rashmica
Gupta, Russell Currey, Gavin Shan, Daniel Axtens, Michael Neuling,
Andrew Donnellan
- Allow wrapper to work on non-english system from Laurent Vivier
- Add rN aliases to the pt_regs_offset table from Rashmica Gupta
- Fix module autoload for rackmeter & axonram drivers from Luis de
Bethencourt
- Include KVM guest test in all interrupt vectors from Paul Mackerras
- Fix DSCR inheritance over fork() from Anton Blanchard
- Make value-returning atomics & {cmp}xchg* & their atomic_ versions
fully ordered from Boqun Feng
- Print MSR TM bits in oops messages from Michael Neuling
- Add TM signal return & invalid stack selftests from Michael Neuling
- Limit EPOW reset event warnings from Vipin K Parashar
- Remove the Cell QPACE code from Rashmica Gupta
- Append linux_banner to exception information in xmon from Rashmica
Gupta
- Add selftest to check if VSRs are corrupted from Rashmica Gupta
- Remove broken GregorianDay() from Daniel Axtens
- Import Anton's context_switch2 benchmark into selftests from
Michael Ellerman
- Add selftest script to test HMI functionality from Daniel Axtens
- Remove obsolete OPAL v2 support from Stewart Smith
- Make enter_rtas() private from Michael Ellerman
- PPR exception cleanups from Michael Ellerman
- Add page soft dirty tracking from Laurent Dufour
- Add support for Nvlink NPUs from Alistair Popple
- Add support for kexec on 476fpe from Alistair Popple
- Enable kernel CPU dlpar from sysfs from Nathan Fontenot
- Copy only required pieces of the mm_context_t to the paca from
Michael Neuling
- Add a kmsg_dumper that flushes OPAL console output on panic from
Russell Currey
- Implement save_stack_trace_regs() to enable kprobe stack tracing
from Steven Rostedt
- Add HWCAP bits for Power9 from Michael Ellerman
- Fix _PAGE_PTE breaking swapoff from Aneesh Kumar K.V
- Fix _PAGE_SWP_SOFT_DIRTY breaking swapoff from Hugh Dickins
- scripts/recordmcount.pl: support data in text section on powerpc
from Ulrich Weigand
- Handle R_PPC64_ENTRY relocations in modules from Ulrich Weigand
cxl:
- cxl: Fix possible idr warning when contexts are released from
Vaibhav Jain
- cxl: use correct operator when writing pcie config space values
from Andrew Donnellan
- cxl: Fix DSI misses when the context owning task exits from Vaibhav
Jain
- cxl: fix build for GCC 4.6.x from Brian Norris
- cxl: use -Werror only with CONFIG_PPC_WERROR from Brian Norris
- cxl: Enable PCI device ID for future IBM CXL adapter from Uma
Krishnan
Freescale:
- Freescale updates from Scott: Highlights include moving QE code out
of arch/powerpc (to be shared with arm), device tree updates, and
minor fixes"
* tag 'powerpc-4.5-1' of git://git.kernel.org/pub/scm/linux/kernel/git/powerpc/linux: (149 commits)
powerpc/module: Handle R_PPC64_ENTRY relocations
scripts/recordmcount.pl: support data in text section on powerpc
powerpc/powernv: Fix OPAL_CONSOLE_FLUSH prototype and usages
powerpc/mm: fix _PAGE_SWP_SOFT_DIRTY breaking swapoff
powerpc/mm: Fix _PAGE_PTE breaking swapoff
cxl: Enable PCI device ID for future IBM CXL adapter
cxl: use -Werror only with CONFIG_PPC_WERROR
cxl: fix build for GCC 4.6.x
powerpc: Add HWCAP bits for Power9
powerpc/powernv: Reserve PE#0 on NPU
powerpc/powernv: Change NPU PE# assignment
powerpc/powernv: Fix update of NVLink DMA mask
powerpc/powernv: Remove misleading comment in pci.c
powerpc: Implement save_stack_trace_regs() to enable kprobe stack tracing
powerpc: Fix build break due to paca mm_context_t changes
cxl: Fix DSI misses when the context owning task exits
MAINTAINERS: Update Scott Wood's e-mail address
powerpc/powernv: Fix minor off-by-one error in opal_mce_check_early_recovery()
powerpc: Fix style of self-test config prompts
powerpc/powernv: Only delay opal_rtc_read() retry when necessary
...
This patchset attempts to new compatible for thermal founding
on RK3228/RK3399 SoCs.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patchset attempts to new compatible for thermal founding
on RK3368 SoCs.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The "init" pinctrl is defined we'll set
pinctrl to this state before probe and then "default" after probe.
Add the "init" and "sleep" pinctrl as the OTP gpio state, since we need
switch the pin to gpio state before the TSADC controller is reset.
AFAIK, the TSADC controller is reset, the tshut polarity will be
a *low* signal in a short period of time for some devices.
Says:
The TSADC get the temperature on rockchip thermal.
If T(current temperature) < (setting temperature), the OTP output the
*high* signal.
If T(current temperature) > (setting temperature), the OTP output the
*low* Signal.
In some cases, the OTP pin is connected to the PMIC, maybe the
PMIC can accept the reset response time to avoid this issue.
In other words, the system will be always reboot if we make the
OTP pin is connected the others IC to control the power.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add OMAP36xx support to ti-soc-thermal driver. This
chip is also unreliable. The data provided here is
based on OMAP36xx TRM:
http://www.ti.com/lit/ug/swpu177aa/swpu177aa.pdf
Signed-off-by: Eduardo Valentin <edubezva@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This adds support for OMAP3 chips to ti-soc-thermal. As requested by
TI people, it is marked unreliable and warning is printed.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The cooling-{min,max}-level properties are marked as optional in
Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt and the usage
in various device tree matches this, i.e., some cooling device in the
device trees provide these properties while others do not.
Make the bindings in
Documentation/devicetree/bindings/thermal/thermal.txt consistent with
the cpufreq-dt bindings by marking the cooling-*-level properties as
optional.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Kumar Gala <galak@codeaurora.org>
Signed-off-by: Rob Herring <robh@kernel.org>
The device trees in the kernel as well as the binding description in
Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt use the
cooling-{min,max}-level property.
Fix the inconsistency with the binding description in
Documentation/devicetree/bindings/thermal/thermal.txt by changing
cooling-*-state properties to cooling-*-level.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Kumar Gala <galak@codeaurora.org>
Signed-off-by: Rob Herring <robh@kernel.org>
This adds documentation of device tree bindings for the
thermal sensor controller of hi6220 SoC.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.
If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Wei Ni