platform_driver does not need to set an owner because
platform_driver_register() will set it.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The exynos thermal driver use the of_thermal_*() API to parse the basic data
for thermal management from devicetree file. So, if CONFIG_EXYNOS_THERMAL is
selected without CONFIG_THERMAL_OF, kernel can build it without any problem.
But, exynos thermal driver is not working with following error log. This patch
add the dependency of CONFIG_THERMAL_OF instead of CONFIG_OF.
[ 1.458644] get_th_reg: Cannot get trip points from of-thermal.c!
[ 1.459096] get_th_reg: Cannot get trip points from of-thermal.c!
[ 1.465211] exynos4412_tmu_initialize: No CRITICAL trip point defined at of-thermal.c!
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
During probe the regulator (if present) was enabled but not disabled in
case of failure. So an unsuccessful probe lead to enabling the
regulator which was actually not needed because the device was not
enabled.
Additionally each deferred probe lead to increase of regulator enable
count so it would not be effectively disabled during removal of the
device.
Test HW: Exynos4412 - Trats2 board
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Fixes: 498d22f616 ("thermal: exynos: Support for TMU regulator defined at device tree")
Cc: <stable@vger.kernel.org>
Reviewed-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The power allocator governor uses ftrace to output a bunch of internal
data for debugging and tuning. Currently, the requested power it
outputs is the "weighted" requested power, that is, what each cooling
device has requested multiplied by the cooling device weight. It is
more useful to trace the real request, without any weight being
applied.
This commit only affects the data traced, there is no functional change.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Main excitement here is Peter Zijlstra's lockless rbtree optimization to
speed module address lookup. He found some abusers of the module lock
doing that too.
A little bit of parameter work here too; including Dan Streetman's breaking
up the big param mutex so writing a parameter can load another module (yeah,
really). Unfortunately that broke the usual suspects, !CONFIG_MODULES and
!CONFIG_SYSFS, so those fixes were appended too.
Cheers,
Rusty.
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Merge tag 'modules-next-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/rusty/linux
Pull module updates from Rusty Russell:
"Main excitement here is Peter Zijlstra's lockless rbtree optimization
to speed module address lookup. He found some abusers of the module
lock doing that too.
A little bit of parameter work here too; including Dan Streetman's
breaking up the big param mutex so writing a parameter can load
another module (yeah, really). Unfortunately that broke the usual
suspects, !CONFIG_MODULES and !CONFIG_SYSFS, so those fixes were
appended too"
* tag 'modules-next-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/rusty/linux: (26 commits)
modules: only use mod->param_lock if CONFIG_MODULES
param: fix module param locks when !CONFIG_SYSFS.
rcu: merge fix for Convert ACCESS_ONCE() to READ_ONCE() and WRITE_ONCE()
module: add per-module param_lock
module: make perm const
params: suppress unused variable error, warn once just in case code changes.
modules: clarify CONFIG_MODULE_COMPRESS help, suggest 'N'.
kernel/module.c: avoid ifdefs for sig_enforce declaration
kernel/workqueue.c: remove ifdefs over wq_power_efficient
kernel/params.c: export param_ops_bool_enable_only
kernel/params.c: generalize bool_enable_only
kernel/module.c: use generic module param operaters for sig_enforce
kernel/params: constify struct kernel_param_ops uses
sysfs: tightened sysfs permission checks
module: Rework module_addr_{min,max}
module: Use __module_address() for module_address_lookup()
module: Make the mod_tree stuff conditional on PERF_EVENTS || TRACING
module: Optimize __module_address() using a latched RB-tree
rbtree: Implement generic latch_tree
seqlock: Introduce raw_read_seqcount_latch()
...
Pull thermal management updates from Zhang Rui:
"Specifics:
- enhance Thermal Framework with several new capabilities:
* use power estimates
* compute weights with relative integers instead of percentages
* allow governors to have private data in thermal zones
* export thermal zone parameters through sysfs
Thanks to the ARM thermal team (Javi, Punit, KP).
- introduce a new thermal governor: power allocator. First in kernel
closed loop PI(D) controller for thermal control. Thanks to ARM
thermal team.
- enhance OF thermal to allow thermal zones to have sustainable power
HW specification. Thanks to Punit.
- introduce thermal driver for Intel Quark SoC x1000platform. Thanks
to Ong, Boon Leong.
- introduce QPNP PMIC temperature alarm driver. Thanks to Ivan T. I.
- introduce thermal driver for Hisilicon hi6220. Thanks to
kongxinwei.
- enhance Exynos thermal driver to handle Exynos5433 TMU. Thanks to
Chanwoo C.
- TI thermal driver now has a better implementation for EOCZ bit.
From Pavel M.
- add id for Skylake processors in int340x processor thermal driver.
- a couple of small fixes and cleanups."
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
thermal: hisilicon: add new hisilicon thermal sensor driver
dt-bindings: Document the hi6220 thermal sensor bindings
thermal: of-thermal: add support for reading coefficients property
thermal: support slope and offset coefficients
thermal: power_allocator: round the division when divvying up power
thermal: exynos: Add the support for Exynos5433 TMU
thermal: cpu_cooling: Fix power calculation when CPUs are offline
thermal: cpu_cooling: Remove cpu_dev update on policy CPU update
thermal: export thermal_zone_parameters to sysfs
thermal: cpu_cooling: Check memory allocation of power_table
ti-soc-thermal: request temperature periodically if hw can't do that itself
ti-soc-thermal: implement eocz bit to make driver useful on omap3
cleanup ti-soc-thermal
thermal: remove stale THERMAL_POWER_ACTOR select
thermal: Default OF created trip points to writable
thermal: core: Add Kconfig option to enable writable trips
thermal: x86_pkg_temp: drop const for thermal_zone_parameters
of: thermal: Introduce sustainable power for a thermal zone
thermal: add trace events to the power allocator governor
thermal: introduce the Power Allocator governor
...
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Most code already uses consts for the struct kernel_param_ops,
sweep the kernel for the last offending stragglers. Other than
include/linux/moduleparam.h and kernel/params.c all other changes
were generated with the following Coccinelle SmPL patch. Merge
conflicts between trees can be handled with Coccinelle.
In the future git could get Coccinelle merge support to deal with
patch --> fail --> grammar --> Coccinelle --> new patch conflicts
automatically for us on patches where the grammar is available and
the patch is of high confidence. Consider this a feature request.
Test compiled on x86_64 against:
* allnoconfig
* allmodconfig
* allyesconfig
@ const_found @
identifier ops;
@@
const struct kernel_param_ops ops = {
};
@ const_not_found depends on !const_found @
identifier ops;
@@
-struct kernel_param_ops ops = {
+const struct kernel_param_ops ops = {
};
Generated-by: Coccinelle SmPL
Cc: Rusty Russell <rusty@rustcorp.com.au>
Cc: Junio C Hamano <gitster@pobox.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Kees Cook <keescook@chromium.org>
Cc: Tejun Heo <tj@kernel.org>
Cc: Ingo Molnar <mingo@kernel.org>
Cc: cocci@systeme.lip6.fr
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Luis R. Rodriguez <mcgrof@suse.com>
Signed-off-by: Rusty Russell <rusty@rustcorp.com.au>
In order to avoid having each driver adding their own
specific DT property to specify slope and offset,
this patch adds a basic coefficient reading from
DT thermal zone node. Right now, as the thermal
framework does not support multiple sensors,
the current coefficients apply only to the only
sensor in the thermal zone.
The supported equation is a simple linear model:
slope * <sensor reading> + offset.
slope and offset are read from the coefficients
DT property. In the same way as it is described in
the DT thermal binding.
So, as of today, the thermal framework will support
only cases like:
/* hotspot = 1 * adc + 6000 */
coefficients = <1 6000>;
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.
This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.
The constants are available through sysfs.
It is up to the device driver to determine
the usage of these values.
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In situations where there is an uneven number of cooling devices, the
division of power among them can lead to a milliwatt being dropped on
the floor due to rounding errors. This doesn't sound like a lot, but
some devices only grant the lowest cooling device state for their
maximum power. So for instance, if the granted_power is the maximum
power and all devices are getting their maximum power, one would get
max_power - 1, making it choose cooling device state 1, instead of 0.
Round the division to make the calculation more accurate.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
There is a copy and paste bug, "->clk" vs "->pclk", so we return the
wrong error code here.
Fixes: cbac8f6394 ('thermal: rockchip: add driver for thermal')
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Caesar Wang <wxt@rock-chips.com>
Reviewed-by: Doug Anderson <dianders@chromium.org>
Tested-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Package C8 to C10 was introduced in newer Intel CPUs, we need to
include them in the package c-state residency calculation.
Otherwise, idle injection target is not accurately maintained by
the closed control loop.
Also cleaned up the code to make it scale better with large number
of c-states.
Reported-by: Kristen Carlson Accardi <kristen@linux.intel.com>
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Broadwell server has support for package C-states, idle injection works
as expected on this platform.
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Mark the module init / exit functions with __init / __exit accodingly.
This allows making the intel_powerclamp_ids[] array __initconst, too, as
it only gets referenced from powerclamp_probe(). This is safe as
file2alias doesn't care about the section, but the symbol name for the
MODULE_DEVICE_TABLE alias.
Cc: Arjan van de Ven <arjan@linux.intel.com>
Cc: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Mathias Krause <minipli@googlemail.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
DESCRIPTION
Spurious Thermal Alert: Talert can happen randomly while the device remains
under the temperature limit defined for this event to trig. This spurious
event is caused by a incorrect re-synchronization between clock domains.
The comparison between configured threshold and current temperature value
can happen while the value is transitioning (metastable), thus causing
inappropriate event generation. No spurious event occurs as long as the
threshold value stays unchanged. Spurious event can be generated while a
thermal alert threshold is modified in
CONTROL_BANDGAP_THRESHOLD_MPU/GPU/CORE/DSPEVE/IVA_n.
WORKAROUND
Spurious event generation can be avoided by performing following sequence
when the threshold is modified:
1. Mask the hot/cold events at the thermal IP level.
2. Modify Threshold.
3. Unmask the hot/cold events at the thermal IP level.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Bandgap Temperature read Dtemp can be corrupted
DESCRIPTION
Read accesses to registers listed below can be corrupted due to
incorrect resynchronization between clock domains.
Read access to registers below can be corrupted :
• CTRL_CORE_DTEMP_MPU/GPU/CORE/DSPEVE/IVA_n (n = 0 to 4)
• CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA_n
WORKAROUND
Multiple reads to CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA[9:0]:
BGAP_DTEMPMPU/GPU/CORE/DSPEVE/IVA is needed to discard false value and
read right value:
1. Perform two successive reads to BGAP_DTEMP bit field.
(a) If read1 returns Val1 and read2 returns Val1, then
right value is Val1.
(b) If read1 returns Val1, read 2 returns Val2, a third
read is needed.
2. Perform third read
(a) If read3 returns Val2 then right value is Val2.
(b) If read3 returns Val3, then right value is Val3.
The above in gist means if val1 and val2 are the same then we can go
ahead with that value else we need a third read which will be right
since synchronization will be complete by then.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch adds the support for Exynos5433's TMU (Thermal Management Unit).
Exynos5433 has a little different register bit fields as following description:
- Support the eight trip points for rising/falling interrupt by using two registers
- Read the calibration type (1-point or 2-point) and sensor id from TRIMINFO register
- Use a little different register address
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Ensure that the CPU for which the frequency is being requested
is online. If none of the CPUs are online the requested power is
returned as 0.
Acked-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It was initially understood that an update to the cpu_device
(cached in cpufreq_cooling_device) was required to ascertain the
correct operating point of the device on a cpufreq policy->cpu update
or creation or deletion of a cpufreq policy.
(e.g. when the existing policy CPU goes offline).
This update is not required and it is possible to ascertain the OPPs
from the leading CPU in a cpufreq domain even if the CPU is hotplugged out.
Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API")
Acked-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It's useful for tuning to be able to edit thermal_zone_parameters from
userspace. Export them to the thermal_zone sysfs so that they can be
easily changed.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
We allocate the power_table in memory but we don't test whether the
allocation succeeded. Return -ENOMEM if kcalloc() fails.
Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API")
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Reported-by: kbuild test robot <fengguang.wu@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When periodic mode is not enabled, it is neccessary to force reads.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
For omap3, proper implementation of eocz bit is needed. It was
actually a TODO in the driver.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Simplify code by removing goto's where they point to simple return.
Avoid confusing |= on error values.
Correct whitespace.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
A previous version of this patch had a config for THERMAL_POWER_ACTOR
but it was dropped. Remove the select as it is not doing anything.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reported-by: Valentin Rothberg <valentinrothberg@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When registering a thermal zone from device tree, default the trip
points to writable. By default, only the root user can change these.
This allows the trip points to be tweaked after the system has
booted.
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a Kconfig option to allow system integrators to control whether
userspace tools can change trip temperatures. This option overrides
the thermal zone setup in the driver code and must be enabled for
platform specified writable trips to come into effect.
The original behaviour of requiring root privileges to change trip
temperatures remains unchanged.
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
8754d5115693 ("thermal: introduce the Power Allocator governor") dropped
the const attribute in the struct thermal_zone_device. That means that
the thermal_zone_params pointer passed to thermal_zone_device_register()
also lost the const qualifier. Drop the const in x86_pkg_temp_thermal.c
as well to avoid the following warning as reported by the kbuild test
robot:
drivers/thermal/x86_pkg_temp_thermal.c: In function 'pkg_temp_thermal_device_add':
>> drivers/thermal/x86_pkg_temp_thermal.c:450:31: warning: passing argument 6 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type
phy_dev_entry, &tzone_ops, &pkg_temp_tz_params, 0, 0);
^
In file included from drivers/thermal/x86_pkg_temp_thermal.c:30:0:
include/linux/thermal.h:378:29: note: expected 'struct thermal_zone_params *' but argument is of type 'const struct thermal_zone_params *'
struct thermal_zone_device *thermal_zone_device_register(const char *, int, int,
^
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.
If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add trace events for the power allocator governor and the power actor
interface of the cpu cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Ingo Molnar <mingo@redhat.com>
Acked-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.
This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.
The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a basic power model to the cpu cooling device to implement the
power cooling device API. The power model uses the current frequency,
current load and OPPs for the power calculations. The cpus must have
registered their OPPs using the OPP library.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add three optional callbacks to the cooling device interface to allow
them to express power. In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
A governor may need to store its current state between calls to
throttle(). That state depends on the thermal zone, so store it as
private data in struct thermal_zone_device.
The governors may have two new ops: bind_to_tz() and unbind_from_tz().
When provided, these functions let governors do some initialization
and teardown when they are bound/unbound to a tz and possibly store that
information in the governor_data field of the struct
thermal_zone_device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.
Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.
Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone. The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100. This complicates setups, as you need to know
in advance how many cooling devices you are going to have. If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone. Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.
This patch generalizes the concept of weight by allowing any number to
be a "weight". Weights are now relative to each other. Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.
It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to. This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100. If they do, you get the same behavior as
before. If they don't, fair share now works for that platform.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It's useful to have access to the weights for the cooling devices for
thermal zones and change them if needed. Export them to sysfs.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The fair share governor is not usable with thermal zones that use the
bind op and don't populate thermal_zone_parameters, the majority of
them. Now that the weight is in the thermal instance, we can use that
in the fair share governor to allow every thermal zone to trivially use
this governor. Furthermore, this simplifies the code.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.
Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.
While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch enables intel_powerclamp driver to run on the
next-generation Intel(R) Xeon Phi Microarchitecture
code named "Knights Landing"
Signed-off-by: Dasaratharaman Chandramouli <dasaratharaman.chandramouli@intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Zhang Rui