Release 0.2.3: Address packaging comments

- Address packaging comments made during Fedora packaging review. - Rebase on a master branch that has fixes for mingw install and macOS test
2019-03-18 11:28:43 +01:00 · 2019-03-18 11:28:43 +01:00 · 0ca010cfdf
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+v0.2.3          Address packaging review comments
+    
+    See https://bugzilla.redhat.com/show_bug.cgi?id=1689277#c7
+
 v0.2.2          Release 0.2.2: Address packaging issues reported by rpmlint
    
    - Presence of .c files in a non-devel package