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Release 0.2.3: Address packaging comments 

- Address packaging comments made during Fedora packaging review.
- Rebase on a master branch that has fixes for mingw install and macOS test
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Christophe de Dinechin 2019-03-18 11:28:43 +01:00
parent c8aa5562e5
commit 0ca010cfdf
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v0.2.3 Address packaging review comments
See https://bugzilla.redhat.com/show_bug.cgi?id=1689277#c7
v0.2.2 Release 0.2.2: Address packaging issues reported by rpmlint v0.2.2 Release 0.2.2: Address packaging issues reported by rpmlint
- Presence of .c files in a non-devel package - Presence of .c files in a non-devel package